Related Documents - Vishay Analog switches and multiplexers, 5V and below, SPST

Related Documents

  Markings (5)
  Pad Guidlines (10)
  Package Drawing (12)
  Reliability Data (17)
  Reel Info (1)
  Tape Info (19)
  SPICE (1)

Markings
PART MARKING	TSOP-5/6
PART MARKING	SO-8
PART MARKING	MICRO FOOT Devices
PART MARKING	SO-14, SO-16, S0-20, S0-24, and SO-28 Narrow and Wide Body Devices
PART MARKING	SC-70 for TN, TP, TC and DG Part Numbers

Pad Guidlines
AN505 - QFN-16 4x4	Recommended Minimum PAD Pattern
AN808	Mounting LITTLE FOOT SO-8 Power MOSFETs
AN823	Mounting LITTLE FOOT TSOP-6 Power MOSFETs
AN824	PCB Design and Assembly Guidelines for MICRO FOOT Products
AN826 - SO-16	Recommended Minimum PAD Pattern
AN826 - SO-8	Recommended Minimum PAD Pattern
AN826 - TSOP-6	Recommended Minimum PAD Pattern
Application Note 826	RECOMMENDED MINIMUM PADS FOR So-8
Application Note 826	RECOMMENDED MINIMUM PADS FOR So-16
Application Note 826	RECOMMENDED MINIMUM PADS FOR TSOP-6

Package Drawing
5300	SOIC-16 (Narrow)
5498	SOIC-8 (Narrow)
5540	TSOP (5L & 6L)
5845	TSSOP 16L
5861	SC-70 5L
5867	MSOP-8
5890	QFN (4 x 4) 16L
5895	SOT-23 8L
5954	miniQFN-16L
5958	miniQFN-6L
5964	miniQFN-8L
Package Information	MiniQFN-8L CASE OUTLINE

Reliability Data
Package Reliability	Environmental and Package Testing Data For SOIC 14-28 Lead
Package Reliability	Environmental and Package Testing Data For TSSOP 14-28 Lead
Package Reliability	Environmental and Package Testing Data For SOIC 8 Lead (DY)
Package Reliability	Environmental and Package Testing Data For MICRO FOOT (0.8 mm Pitch)
Package Reliability	Environmental and Package Testing Data For MLP/QFN
Package Reliability	Environmental and Package Testing Data For MSOP
Package Reliability	Environmental and Package Testing Data For SC-70
Package Reliability	SC-70-3
Package Reliability	Environmental and Package Testing Data For SOT-23
Package Reliability	SC-70-3
Package Reliability	Environmental and Package Testing Data For TSOP-5/6
Package Reliability	Environmental and Package Testing Data For miniQFN-6
Package Reliability	Environmental and Package Testing Data For miniQFN-16
Silicon Technology Reliability	Accelerated Operating Life Test Result
Silicon Technology Reliability	Accelerated Operating Life Test Result
Silicon Technology Reliability	Accelerated Operating Life Test Result
Silicon Technology Reliability	Accelerated Operating Life Test Result

Tape Info
90-2347-x	Tape Drawing for TSSOP-16
91-5209-x	Tape Drawing for SOIC (8L, 14L, 16L Narrow & 14L, 20L, 24L Wide)
91-5209-x	Tape Drawing for SOT-143 (Low & High) & SOT23-8
93-2345-x	Tape Drawing for TSOP-6
93-5213-1	Tape Drawing for SC-70 5L/6L
93-5216-1	Tape Drawing for MSOP-8
93-5221-x	Tape Drawing for MICRO FOOT 3x2, 0.5-mm Pitch, 0.165-mm Bump Height
93-5225-x	Tape Drawing for MLP(QFN), 4x4/3x3 and DFN-10 3x3
93-5238-x	Tape Drawing for MICRO FOOT 8-B, 3x3, 0.5 mm Pitch
93-5256-X	miniQFN-8L
PACK-0007-11	Device Orientation for SC70-5L and TSOP-5L (T1)
PACK-0007-15	Device Orientation for QFN-16 (T1)
PACK-0007-5	Device Orientation for SOT23-8L (t1)
PACK-0007-6	Device Orientation for MSOP, SOIC, SSOP, and TSSOP (T1)
PACK-0007-8/9	Device Orientation for SC70-6L, SC89-6L, TSOP-6 (Single, Dual, Complementary or Dual Symmetrical) (T1)
PACK-0023-4	Device Orientation for Analog ICs, MICRO FOOT 3x2: 0.5-mm Pitch, 0.165-mm Bump Height (T1)
PACK-0023-7	Device Orientation for Analog ICs, MICRO FOOT 3x3: 0.5-mm Pitch, 0.238-mm Bump Height (T5)
PACK-0023-9	Device Orientation for Analog ICs, MICRO FOOT 3x3: 0.5-mm Pitch, 0.238-mm Bump Height (T1)
Tape Information	PolarPAK? Carrier Tape

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