Related Documents - MICRO FOOT Package

  Markings (1)
  Ordering Info (1)
  Package Drawings (4)
  Pad Guidelines (1)
  Reel Info (1)
  Reliability Data (5)
  Tape Info (9)

Markings [top]
PART MARKING	MICRO FOOT Devices

Ordering Info [top]
Part Numbering	Part Numbering Nomenclature

Package Drawings [top]
Package Information	Micro Foot: 10-Bump (4 mm x 3 mm, 0.5 mm Pitch, 0.238 mm Bump Height)
Package Information	Micro Foot: 16-Bump (4 mm x 4 mm, 0.5 mm Pitch, 0.238 mm Bump Height)
Package Information	Micro Foot: 6-Bump (3 mm x 2 mm, 0.5 mm Pitch, 165 µm Bump Height)
Package Information	Micro Foot: 8-Bump (3 mm x 3 mm, 0.5 mm Pitch, 0.238 mm Bump Height)

Pad Guidelines [top]
PAD Pattern	MICRO FOOT Products

Reel Info [top]
Reel Information	Lok Reel

Reliability Data [top]
Package Reliability	Environmental and Package Testing Data For MICRO FOOT 4x4 and 4x3
Package Reliability	Environmental and Package Testing Data for MICRO FOOT®
Silicon Technology Reliability	Accelerated Operating Life Test Result
Silicon Technology Reliability	Accelerated Operating Life Test Result
Silicon Technology Reliability	Accelerated Operating Life Test Result

Tape Info [top]
93-5221-x	Tape Drawing for MICRO FOOT 3x2, 0.5-mm Pitch, 0.165-mm Bump Height
93-5226-x	Tape Drawing for MICRO FOOT 4x4, 0.5 mm Pitch, 0.238 b
93-5237-x	Tape Drawing for MICRO FOOT 4x3, 0.5 mm Pitch, 0.238 b
93-5238-x	Tape Drawing for MICRO FOOT 8-B, 3x3, 0.5 mm Pitch
PACK-0023-4	Device Orientation for Analog ICs, MICRO FOOT 3x2: 0.5-mm Pitch, 0.165-mm Bump Height (T1)
PACK-0023-5	Device Orientation for Analog ICs, MICRO FOOT 4x4: 0.5-mm Pitch, 0.225-mm Bump Height (T2)
PACK-0023-7	Device Orientation for Analog ICs, MICRO FOOT 3x3: 0.5-mm Pitch, 0.238-mm Bump Height (T5)
PACK-0023-8	Device Orientation for Analog ICs, MICRO FOOT 4x3: 0.5-mm Pitch, 0.238-mm Bump Height (T5)
PACK-0023-9	Device Orientation for Analog ICs, MICRO FOOT 3x3: 0.5-mm Pitch, 0.238-mm Bump Height (T1)