Related Documents - Sub ohm
Markings (3)
Ordering Info (1)
Package Drawings (13)
Pad Guidelines (4)
Promotional Materials (3)
Reel Info (1)
Reliability Data (14)
Selector Guides (1)
Tape Info (17)
SPICE (1)
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Markings
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PART MARKING |
MICRO FOOT Devices |
PART MARKING |
SC-70 for TN, TP, TC and DG Part Numbers |
PART MARKING |
SC-89 (SOT-666 Only) Devices |
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Ordering Info
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Part Numbering |
Part Numbering Nomenclature |
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Package Drawings
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5550 |
SC-70 6L |
5851 |
TSSOP 28L |
5861 |
SC-70 5L |
5867 |
MSOP-10 |
5867 |
MSOP-8 |
5891 |
SC-89 (SOT-666) 6L |
5895 |
SOT-23 8L |
5899 |
QFN (3 x 3) 16L |
5943 |
DFN-10 Lead ( 3 x 3) |
5954 |
miniQFN-16L |
5957 |
miniQFN-10L |
5964 |
MiniQFN-8L |
Package Information |
Micro Foot: 6-Bump (3 mm x 2 mm, 0.5 mm Pitch, 165 µm Bump Height) |
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Pad Guidelines
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PAD Pattern |
MICRO FOOT Products |
PAD Pattern |
MINI QFN 10L |
PAD Pattern |
MINI QFN 16L |
PAD Pattern |
MINI QFN 8L |
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Promotional Materials
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DG508B/DG509B Product Sheet |
8- and Dual 4-Channel Analog Multiplexers |
Hi-Rel Components Product Sheet |
Power MOSFETs, Analog Switches and Multiplexers |
Selector Guide |
Analog Switches and Multiplexers |
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Reel Info
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Reel Information |
Lok Reel |
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Reliability Data
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Package Reliability |
Environmental and Package Testing Data For DFN-10 |
Package Reliability |
Environmental and Package Testing Data For MICRO FOOT (0.8 mm Pitch) |
Package Reliability |
Environmental and Package Testing Data For miniQFN-10 |
Package Reliability |
Environmental and Package Testing Data For miniQFN-16 |
Package Reliability |
Environmental and Package Testing Data For MLP/QFN |
Package Reliability |
Environmental and Package Testing Data For MSOP |
Package Reliability |
Environmental and Package Testing Data For SC-70 |
Package Reliability |
Environmental and Package Testing Data For SC-89 |
Package Reliability |
Environmental and Package Testing Data For SOT-23 |
Silicon Technology Reliability |
Accelerated Operating Life Test Result |
Silicon Technology Reliability |
Accelerated Operating Life Test Result |
Silicon Technology Reliability |
Accelerated Operating Life Test Result |
Silicon Technology Reliability |
Accelerated Operating Life Test Result |
Silicon Technology Reliability |
VIS BCD Process Technology 200901 to 201103 |
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Selector Guides
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Selector Guide |
Analog Switches and Multiplexers |
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Tape Info
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91-5209-x |
Tape Drawing for SOT-143 (Low & High) & SOT23-8 |
93-5213-X |
SC-70 3-LEADS (T2-METHOD) |
93-5216-1 |
Tape Drawing for MSOP-10 |
93-5216-1 |
Tape Drawing for MSOP-8 |
93-5221-x |
Tape Drawing for MICRO FOOT 3x2, 0.5-mm Pitch, 0.165-mm Bump Height |
93-5232-X |
Tape Drawing for SC-89 (SOT-666) 6-LEAD |
93-5251-X |
MINIQFN-16L (2.6 x 1.8 mm) CARRIER TAPE |
93-5254-X |
MINIQFN-10L CARRIER TAPE |
93-5256-X |
MINIQFN-8L CARRIER TAPE |
PACK-0007-10 |
Device Orientation for SC89-6L (SOT-666) (T1) |
PACK-0007-11 |
Device Orientation for SC70-5L and TSOP-5L (T1) |
PACK-0007-15 |
Device Orientation for QFN-12/QFN-16 |
PACK-0007-5 |
Device Orientation for SOT23-8L (t1) |
PACK-0007-6 |
Device Orientation for MSOP, SOIC, SSOP, and TSSOP (T1) |
PACK-0007-8/9 |
Device Orientation for SC70-6L, SC89-6L, TSOP-6 (Single, Dual, Complementary or Dual Symmetrical) (T1) |
PACK-0023-4 |
Device Orientation for Analog ICs, MICRO FOOT 3x2: 0.5-mm Pitch, 0.165-mm Bump Height (T1) |
Tape Information |
Tape Drawing for PowerPAK®, MLP(QFN), 4 x 4/3 x 3, DFN-10, 3 x 3, MLP33-8/10 |
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SPICE
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| Spice Model (pdf) | |||||
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