Related Documents - Analog switches and multiplexers
Markings (6)
Ordering Info (1)
Package Drawings (52)
Pad Guidelines (13)
Promotional Materials (4)
Reel Info (1)
Reliability Data (33)
Selector Guides (1)
Tape Info (31)
SPICE (1)
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Markings
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|
 PART MARKING |
MICRO FOOT Devices |
| PART MARKING |
SC-70 for TN, TP, TC and DG Part Numbers |
| PART MARKING |
SC-89 (SOT-666 Only) Devices |
| PART MARKING |
SO-14, SO-16, S0-20, S0-24, and SO-28 Narrow and Wide Body Devices |
| PART MARKING |
SO-8 |
| PART MARKING |
TSOP-5/6 |
|
Ordering Info
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|
| Part Numbering |
Part Numbering Nomenclature |
|
Package Drawings
|
|
| 5300 |
SOIC-16 (Narrow) |
| 5302 |
SOIC-18 (Wide) |
| 5306 |
PLCC 20L |
| 5308 |
Ceramic QUAD (J-Lead) |
| 5309 |
Sidebraze DIP 20L |
| 5313 |
Ceramic DIP 18L |
| 5319 |
LCC-28 |
| 5321 |
LCC-20 |
| 5342 |
Flat Package (L-Suffix) 14L JEDEC: MO-004AF (TO-87) |
| 5348 |
Ceramic DIP 8L |
| 5401 |
Sidebraze DIP 28L |
| 5402 |
Ceramic DIP 14L |
| 5403 |
Ceramic DIP 16L |
| 5418 |
Sidebraze DIP 16L |
| 5419 |
Sidebraze DIP 14L |
| 5430 |
Flat Package (L-Suffix) 16L |
| 5434 |
Ceramic DIP 28L |
| 5450 |
TO-100 (Metal Can) 10L |
| 5478 |
Plastic DIP 8L |
| 5481 |
Plastic DIP 14L |
| 5482 |
PDIP 16L |
| 5484 |
Plastic DIP 20L |
| 5488 |
Plastic DIP 28L |
| 5491 |
PLCC: 28-LEAD |
| 5492 |
44 LEAD PLCC CASE OUTLINE |
| 5498 |
SOIC-8 (Narrow) |
| 5499 |
SOIC-14 (Narrow) |
| 5540 |
TSOP (5L & 6L) |
| 5550 |
SC-70 6L |
| 5624 |
TSSOP-16 |
| 5848 |
SOIC-20 (Wide) |
| 5850 |
SOIC (Wide-Body): 28-LEADS |
| 5851 |
TSSOP 28L |
| 5861 |
SC-70 5L |
| 5867 |
MSOP-10 |
| 5867 |
MSOP-8 |
| 5890 |
QFN (4 x 4) 16L |
| 5891 |
SC-89 (SOT-666) 6L |
| 5895 |
SOT-23 8L |
| 5898 |
QFN (3 x 3) 12L |
| 5899 |
QFN (3 x 3) 16L |
| 5943 |
DFN-10 Lead ( 3 x 3) |
| 5954 |
miniQFN-16L |
| 5957 |
miniQFN-10L |
| 5958 |
miniQFN-6L |
| 5962 |
14L TSSOP |
| 5964 |
MiniQFN-8L |
| 5997 |
TDFN8 2x2 |
| Package Information |
Micro Foot: 10-Bump (4 mm x 3 mm, 0.5 mm Pitch, 0.238 mm Bump Height) |
| Package Information |
Micro Foot: 16-Bump (4 mm x 4 mm, 0.5 mm Pitch, 0.238 mm Bump Height) |
| Package Information |
Micro Foot: 6-Bump (3 mm x 2 mm, 0.5 mm Pitch, 165 µm Bump Height) |
| Package Information |
Micro Foot: 8-Bump (3 mm x 3 mm, 0.5 mm Pitch, 0.238 mm Bump Height) |
|
Pad Guidelines
|
|
| PAD Pattern |
LITTLE FOOT SO-8 Power MOSFETs |
| PAD Pattern |
LITTLE FOOT TSOP-6 Power MOSFETs |
| PAD Pattern |
MICRO FOOT Products |
| PAD Pattern |
MINI QFN 10L |
| PAD Pattern |
MINI QFN 16L |
| PAD Pattern |
MINI QFN 6L |
| PAD Pattern |
MINI QFN 8L |
| PAD Pattern |
QFN-16 4x4 |
| PAD Pattern |
SO-14 |
| PAD Pattern |
SO-16 |
| PAD Pattern |
SO-8 |
| PAD Pattern |
TSOP-6 |
| PAD Pattern |
TSSOP-16 |
|
Promotional Materials
|
|
| DG508B/DG509B Product Sheet |
8- and Dual 4-Channel Analog Multiplexers |
| Hi-Rel Components Product Sheet |
Power MOSFETs, Analog Switches and Multiplexers |
| Product Overview |
ThermaSim Thermal Simulation Tool |
| Selector Guide |
Analog Switches and Multiplexers |
|
Reel Info
|
|
| Reel Information |
Lok Reel |
|
Reliability Data
|
|
| Package Reliability |
Environmental and Package Testing Data For CerDIP/Sidebraze |
| Package Reliability |
Environmental and Package Testing Data For Cerquad |
| Package Reliability |
Environmental and Package Testing Data For DFN-10 |
| Package Reliability |
Environmental and Package Testing Data For Flat Pack 14/16 |
| Package Reliability |
Environmental and Package Testing Data For LCC 20-28 Lead |
| Package Reliability |
Environmental and Package Testing Data For Metal Can |
| Package Reliability |
Environmental and Package Testing Data For MICRO FOOT (0.8 mm Pitch) |
| Package Reliability |
Environmental and Package Testing Data For MICRO FOOT 4x4 and 4x3 |
| Package Reliability |
Environmental and Package Testing Data For miniQFN-10 |
| Package Reliability |
Environmental and Package Testing Data For miniQFN-16 |
| Package Reliability |
Environmental and Package Testing Data For miniQFN-6 |
| Package Reliability |
Environmental and Package Testing Data For MLP/QFN |
| Package Reliability |
Environmental and Package Testing Data For MSOP |
| Package Reliability |
Environmental and Package Testing Data For PDIP 8-28 Lead |
| Package Reliability |
Environmental and Package Testing Data For PLCC |
| Package Reliability |
Environmental and Package Testing Data For SC-70 |
| Package Reliability |
Environmental and Package Testing Data For SC-89 |
| Package Reliability |
Environmental and Package Testing Data For SOIC 14-28 Lead |
| Package Reliability |
Environmental and Package Testing Data For SOIC 8 Lead (DY) |
| Package Reliability |
Environmental and Package Testing Data For SOT-23 |
| Package Reliability |
Environmental and Package Testing Data For TSOP-5/6 |
| Package Reliability |
Environmental and Package Testing Data For TSSOP 14-28 Lead |
| Package Reliability |
Environmental and Package Testing Data For TSSOP14 |
| Silicon Technology Reliability |
Accelerated Operating Life Test Result |
| Silicon Technology Reliability |
Accelerated Operating Life Test Result |
| Silicon Technology Reliability |
Accelerated Operating Life Test Result |
| Silicon Technology Reliability |
Accelerated Operating Life Test Result |
| Silicon Technology Reliability |
Accelerated Operating Life Test Result |
| Silicon Technology Reliability |
Accelerated Operating Life Test Result |
| Silicon Technology Reliability |
Accelerated Operating Life Test Result |
| Silicon Technology Reliability |
Accelerated Operating Life Test Result |
| Silicon Technology Reliability |
Accelerated Operating Life Test Result |
| Silicon Technology Reliability |
VIS BCD Process Technology 200901 to 201103 |
|
Selector Guides
|
|
| Selector Guide |
Analog Switches and Multiplexers |
|
Tape Info
|
|
| 90-2347-x |
Tape Drawing for TSSOP-14, 16/PowerPAK TSSOP-16 |
| 91-5209-x |
Tape Drawing for SOIC PACKAGES (NARROW AND WIDE BODY) |
| 91-5209-x |
Tape Drawing for SOT-143 (Low & High) & SOT23-8 |
| 93-2345-X |
TSOP: 5/6-Lead (SC-59) |
| 93-5213-X |
SC-70 3-LEADS (T2-METHOD) |
| 93-5216-1 |
Tape Drawing for MSOP-10 |
| 93-5216-1 |
Tape Drawing for MSOP-8 |
| 93-5221-x |
Tape Drawing for MICRO FOOT 3x2, 0.5-mm Pitch, 0.165-mm Bump Height |
| 93-5226-x |
Tape Drawing for MICRO FOOT 4x4, 0.5 mm Pitch, 0.238 b |
| 93-5232-X |
Tape Drawing for SC-89 (SOT-666) 6-LEAD |
| 93-5235-x |
Tape Drawing for PLCC-28 |
| 93-5237-x |
Tape Drawing for MICRO FOOT 4x3, 0.5 mm Pitch, 0.238 b |
| 93-5238-x |
Tape Drawing for MICRO FOOT 8-B, 3x3, 0.5 mm Pitch |
| 93-5251-X |
MINIQFN-16L (2.6 x 1.8 mm) CARRIER TAPE |
| 93-5254-X |
MINIQFN-10L CARRIER TAPE |
| 93-5255-X |
MINIQFN-6L CARRIER TAPE |
| 93-5256-X |
MINIQFN-8L CARRIER TAPE |
| 93-5277-X |
Tape Drawing for TDFN8 2.0 x 2.0 CARRIER TAPE |
| PACK-0007-10 |
Device Orientation for SC89-6L (SOT-666) (T1) |
| PACK-0007-11 |
Device Orientation for SC70-5L and TSOP-5L (T1) |
| PACK-0007-15 |
Device Orientation for QFN-12/QFN-16 |
| PACK-0007-5 |
Device Orientation for SOT23-8L (t1) |
| PACK-0007-6 |
Device Orientation for MSOP, SOIC, SSOP, and TSSOP (T1) |
| PACK-0007-8/9 |
Device Orientation for SC70-6L, SC89-6L, TSOP-6 (Single, Dual, Complementary or Dual Symmetrical) (T1) |
| PACK-0012 |
Device Orientation for PLCC-20/28/44 (T1) |
| PACK-0023-4 |
Device Orientation for Analog ICs, MICRO FOOT 3x2: 0.5-mm Pitch, 0.165-mm Bump Height (T1) |
| PACK-0023-5 |
Device Orientation for Analog ICs, MICRO FOOT 4x4: 0.5-mm Pitch, 0.225-mm Bump Height (T2) |
| PACK-0023-7 |
Device Orientation for Analog ICs, MICRO FOOT 3x3: 0.5-mm Pitch, 0.238-mm Bump Height (T5) |
| PACK-0023-8 |
Device Orientation for Analog ICs, MICRO FOOT 4x3: 0.5-mm Pitch, 0.238-mm Bump Height (T5) |
| PACK-0023-9 |
Device Orientation for Analog ICs, MICRO FOOT 3x3: 0.5-mm Pitch, 0.238-mm Bump Height (T1) |
| Tape Information |
Tape Drawing for PowerPAK®, MLP(QFN), 4 x 4/3 x 3, DFN-10, 3 x 3, MLP33-8/10 |
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SPICE
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| Spice Model (pdf) | |||||
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