Markings (6)
  Pad Guidlines (9)
  Package Drawing (20)
  Reliability Data (25)
  Reel Info (1)
  Tape Info (17)

Markings
PART MARKING	TSOP-5/6
PART MARKING	SO-8
PART MARKING	SC-89 (SOT-666 Only) Devices
PART MARKING	MICRO FOOT Devices
PART MARKING	SO-14, SO-16, S0-20, S0-24, and SO-28 Narrow and Wide Body Devices
PART MARKING	SC-70 for TN, TP, TC and DG Part Numbers

Pad Guidlines
AN808	Mounting LITTLE FOOT SO-8 Power MOSFETs
AN823	Mounting LITTLE FOOT TSOP-6 Power MOSFETs
AN824	PCB Design and Assembly Guidelines for MICRO FOOT Products
AN826 - SO-16	Recommended Minimum PAD Pattern
AN826 - SO-8	Recommended Minimum PAD Pattern
AN826 - TSOP-6	Recommended Minimum PAD Pattern
Application Note 826	RECOMMENDED MINIMUM PADS FOR So-8
Application Note 826	RECOMMENDED MINIMUM PADS FOR So-16
Application Note 826	RECOMMENDED MINIMUM PADS FOR TSOP-6

Package Drawing
5300	SOIC-16 (Narrow)
5342	Flat Package (L-Suffix) 14L JEDEC: MO-004AF (TO-87)
5418	Sidebraze DIP 16L
5419	Sidebraze DIP 14L
5450	TO-100 (Metal Can) 10L
5478	Plastic DIP 8L
5482	Plastic DIP 16L
5498	SOIC-8 (Narrow)
5540	TSOP (5L & 6L)
5550	SC-70 6L
5845	TSSOP 16L
5867	MSOP-8
5867	MSOP-10
5891	SC-89 (SOT-666) 6L
5898	QFN (3 x 3) 12L
5899	QFN (3 x 3) 16L
5943	DFN-10 Lead ( 3 x 3)
5954	miniQFN-16L
5957	miniQFN-10L
5958	miniQFN-6L

Reliability Data
Package Reliability	Environmental and Package Testing Data For SOIC 14-28 Lead
Package Reliability	Environmental and Package Testing Data For TSSOP 14-28 Lead
Package Reliability	Environmental and Package Testing Data For SOIC 8 Lead (DY)
Package Reliability	Environmental and Package Testing Data For CerDIP/Sidebraze
Package Reliability	Environmental and Package Testing Data For MICRO FOOT (0.8 mm Pitch)
Package Reliability	Environmental and Package Testing Data For Metal Can
Package Reliability	Environmental and Package Testing Data For MLP/QFN
Package Reliability	Environmental and Package Testing Data For MSOP
Package Reliability	Environmental and Package Testing Data For PDIP 8-28 Lead
Package Reliability	Environmental and Package Testing Data For SC-70
Package Reliability	SC-70-3
Package Reliability	Environmental and Package Testing Data For SC-89
Package Reliability	Environmental and Package Testing Data For TSOP-5/6
Package Reliability	Environmental and Package Testing Data For Flat Pack 14/16
Package Reliability	Environmental and Package Testing Data For MICRO FOOT 4x4 and 4x3
Package Reliability	Environmental and Package Testing Data For DFN-10
Package Reliability	Environmental and Package Testing Data For miniQFN-10
Package Reliability	Environmental and Package Testing Data For miniQFN-6
Package Reliability	Environmental and Package Testing Data For miniQFN-16
Silicon Technology Reliability	Accelerated Operating Life Test Result
Silicon Technology Reliability	Accelerated Operating Life Test Result
Silicon Technology Reliability	Accelerated Operating Life Test Result
Silicon Technology Reliability	Accelerated Operating Life Test Result
Silicon Technology Reliability	Accelerated Operating Life Test Result
Silicon Technology Reliability	Accelerated Operating Life Test Result

Reel Info
Reel Information	LOK REEL

Tape Info
90-2347-x	Tape Drawing for TSSOP-16
91-5209-x	Tape Drawing for SOIC (8L, 14L, 16L Narrow & 14L, 20L, 24L Wide)
93-2345-x	Tape Drawing for TSOP-6
93-5213-1	Tape Drawing for SC-70 5L/6L
93-5216-1	Tape Drawing for MSOP-8
93-5216-1	Tape Drawing for MSOP-10
93-5221-x	Tape Drawing for MICRO FOOT 3x2, 0.5-mm Pitch, 0.165-mm Bump Height
93-5225-x	Tape Drawing for MLP(QFN), 4x4/3x3 and DFN-10 3x3
93-5232-x	Tape Drawing for SC-89 6L (SOT-666)
93-5237-x	Tape Drawing for MICRO FOOT 4x3, 0.5 mm Pitch, 0.238 b
PACK-0007-10	Device Orientation for SC89-6L (SOT-666) (T1)
PACK-0007-15	Device Orientation for QFN-16 (T1)
PACK-0007-6	Device Orientation for MSOP, SOIC, SSOP, and TSSOP (T1)
PACK-0007-8/9	Device Orientation for SC70-6L, SC89-6L, TSOP-6 (Single, Dual, Complementary or Dual Symmetrical) (T1)
PACK-0023-4	Device Orientation for Analog ICs, MICRO FOOT 3x2: 0.5-mm Pitch, 0.165-mm Bump Height (T1)
PACK-0023-8	Device Orientation for Analog ICs, MICRO FOOT 4x3: 0.5-mm Pitch, 0.238-mm Bump Height (T5)
Tape Information	PolarPAK? Carrier Tape