Markings (3)
  Pad Guidlines (1)
  Package Drawing (5)
  Reliability Data (11)
  Reel Info (1)
  Tape Info (11)

Markings
PART MARKING	SC-89 (SOT-666 Only) Devices
PART MARKING	MICRO FOOT Devices
PART MARKING	SC-70 for TN, TP, TC and DG Part Numbers

Pad Guidlines
AN824	PCB Design and Assembly Guidelines for MICRO FOOT Products

Package Drawing
5550	SC-70 6L
5867	MSOP-10
5891	SC-89 (SOT-666) 6L
5943	DFN-10 Lead ( 3 x 3)
5957	miniQFN-10L

Reliability Data
Package Reliability	Environmental and Package Testing Data For MICRO FOOT (0.8 mm Pitch)
Package Reliability	Environmental and Package Testing Data For MSOP
Package Reliability	Environmental and Package Testing Data For SC-70
Package Reliability	SC-70-3
Package Reliability	Environmental and Package Testing Data For SC-89
Package Reliability	Environmental and Package Testing Data For MICRO FOOT 4x4 and 4x3
Package Reliability	Environmental and Package Testing Data For DFN-10
Package Reliability	Environmental and Package Testing Data For miniQFN-10
Silicon Technology Reliability	Accelerated Operating Life Test Result
Silicon Technology Reliability	Accelerated Operating Life Test Result
Silicon Technology Reliability	Accelerated Operating Life Test Result

Reel Info
Reel Information	LOK REEL

Tape Info
93-5213-1	Tape Drawing for SC-70 5L/6L
93-5216-1	Tape Drawing for MSOP-10
93-5221-x	Tape Drawing for MICRO FOOT 3x2, 0.5-mm Pitch, 0.165-mm Bump Height
93-5225-x	Tape Drawing for MLP(QFN), 4x4/3x3 and DFN-10 3x3
93-5232-x	Tape Drawing for SC-89 6L (SOT-666)
93-5237-x	Tape Drawing for MICRO FOOT 4x3, 0.5 mm Pitch, 0.238 b
PACK-0007-10	Device Orientation for SC89-6L (SOT-666) (T1)
PACK-0007-6	Device Orientation for MSOP, SOIC, SSOP, and TSSOP (T1)
PACK-0007-8/9	Device Orientation for SC70-6L, SC89-6L, TSOP-6 (Single, Dual, Complementary or Dual Symmetrical) (T1)
PACK-0023-4	Device Orientation for Analog ICs, MICRO FOOT 3x2: 0.5-mm Pitch, 0.165-mm Bump Height (T1)
PACK-0023-8	Device Orientation for Analog ICs, MICRO FOOT 4x3: 0.5-mm Pitch, 0.238-mm Bump Height (T5)