Related Documents - SPST
Markings (5)
Ordering Info (1)
Package Drawings (30)
Pad Guidelines (12)
Reel Info (1)
Reliability Data (24)
Tape Info (23)
SPICE (1)
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Markings
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|
 PART MARKING |
MICRO FOOT Devices |
| PART MARKING |
SC-70 for TN, TP, TC and DG Part Numbers |
| PART MARKING |
SO-14, SO-16, S0-20, S0-24, and SO-28 Narrow and Wide Body Devices |
| PART MARKING |
SO-8 |
| PART MARKING |
TSOP-5/6 |
|
Ordering Info
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| Part Numbering |
Part Numbering Nomenclature |
|
Package Drawings
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|
| 5300 |
SOIC-16 (Narrow) |
| 5306 |
PLCC 20L |
| 5309 |
Sidebraze DIP 20L |
| 5321 |
LCC-20 |
| 5342 |
Flat Package (L-Suffix) 14L JEDEC: MO-004AF (TO-87) |
| 5348 |
Ceramic DIP 8L |
| 5402 |
Ceramic DIP 14L |
| 5403 |
Ceramic DIP 16L |
| 5418 |
Sidebraze DIP 16L |
| 5419 |
Sidebraze DIP 14L |
| 5450 |
TO-100 (Metal Can) 10L |
| 5478 |
Plastic DIP 8L |
| 5481 |
Plastic DIP 14L |
| 5482 |
PDIP 16L |
| 5484 |
Plastic DIP 20L |
| 5498 |
SOIC-8 (Narrow) |
| 5499 |
SOIC-14 (Narrow) |
| 5540 |
TSOP (5L & 6L) |
| 5624 |
TSSOP-16 |
| 5861 |
SC-70 5L |
| 5867 |
MSOP-10 |
| 5867 |
MSOP-8 |
| 5890 |
QFN (4 x 4) 16L |
| 5895 |
SOT-23 8L |
| 5954 |
miniQFN-16L |
| 5958 |
miniQFN-6L |
| 5964 |
MiniQFN-8L |
| 5997 |
TDFN8 2x2 |
| Package Information |
Micro Foot: 6-Bump (3 mm x 2 mm, 0.5 mm Pitch, 165 µm Bump Height) |
| Package Information |
Micro Foot: 8-Bump (3 mm x 3 mm, 0.5 mm Pitch, 0.238 mm Bump Height) |
|
Pad Guidelines
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|
| PAD Pattern |
LITTLE FOOT SO-8 Power MOSFETs |
| PAD Pattern |
LITTLE FOOT TSOP-6 Power MOSFETs |
| PAD Pattern |
MICRO FOOT Products |
| PAD Pattern |
MINI QFN 16L |
| PAD Pattern |
MINI QFN 6L |
| PAD Pattern |
MINI QFN 8L |
| PAD Pattern |
QFN-16 4x4 |
| PAD Pattern |
SO-14 |
| PAD Pattern |
SO-16 |
| PAD Pattern |
SO-8 |
| PAD Pattern |
TSOP-6 |
| PAD Pattern |
TSSOP-16 |
|
Reel Info
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|
| Reel Information |
Lok Reel |
|
Reliability Data
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|
| Package Reliability |
Environmental and Package Testing Data For CerDIP/Sidebraze |
| Package Reliability |
Environmental and Package Testing Data For Flat Pack 14/16 |
| Package Reliability |
Environmental and Package Testing Data For LCC 20-28 Lead |
| Package Reliability |
Environmental and Package Testing Data for METAL CAN |
| Package Reliability |
Environmental and Package Testing Data for MICRO FOOT® |
| Package Reliability |
Environmental and Package Testing Data For miniQFN-16 |
| Package Reliability |
Environmental and Package Testing Data For miniQFN-6 |
| Package Reliability |
Environmental and Package Testing Data For MLP/QFN |
| Package Reliability |
Environmental and Package Testing Data For MSOP |
| Package Reliability |
Environmental and Package Testing Data For PDIP 8-28 Lead |
| Package Reliability |
Environmental and Package Testing Data For PLCC |
| Package Reliability |
Environmental and Package Testing Data for SO-8 |
| Package Reliability |
Environmental and Package Testing Data For SOIC 14-28 Lead |
| Package Reliability |
Environmental and Package Testing Data for SOT-23 |
| Package Reliability |
Environmental and Package Testing Data for TSOP-6 |
| Package Reliability |
Environmental and Package Testing Data For TSSOP 14-28 Lead |
| Silicon Technology Reliability |
Accelerated Operating Life Test Result |
| Silicon Technology Reliability |
Accelerated Operating Life Test Result |
| Silicon Technology Reliability |
Accelerated Operating Life Test Result |
| Silicon Technology Reliability |
Accelerated Operating Life Test Result |
| Silicon Technology Reliability |
Accelerated Operating Life Test Result |
| Silicon Technology Reliability |
Accelerated Operating Life Test Result |
| Silicon Technology Reliability |
Accelerated Operating Life Test Result |
| Silicon Technology Reliability |
Accelerated Operating Life Test Result |
|
Tape Info
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|
| 90-2347-x |
Tape Drawing for TSSOP-14, 16/PowerPAK TSSOP-16 |
| 91-5209-x |
Tape Drawing for SOIC PACKAGES (NARROW AND WIDE BODY) |
| 91-5209-x |
Tape Drawing for SOT-143 (Low & High) & SOT23-8 |
| 93-2345-X |
TSOP: 5/6-Lead (SC-59) |
| 93-5213-X |
SC-70 3-LEADS (T2-METHOD) |
| 93-5216-1 |
Tape Drawing for MSOP-10 |
| 93-5216-1 |
Tape Drawing for MSOP-8 |
| 93-5221-x |
Tape Drawing for MICRO FOOT 3x2, 0.5-mm Pitch, 0.165-mm Bump Height |
| 93-5238-x |
Tape Drawing for MICRO FOOT 8-B, 3x3, 0.5 mm Pitch |
| 93-5251-X |
MINIQFN-16L (2.6 x 1.8 mm) CARRIER TAPE |
| 93-5255-X |
MINIQFN-6L CARRIER TAPE |
| 93-5256-X |
MINIQFN-8L CARRIER TAPE |
| 93-5277-X |
Tape Drawing for TDFN8 2.0 x 2.0 CARRIER TAPE |
| PACK-0007-11 |
Device Orientation for SC70-5L and TSOP-5L (T1) |
| PACK-0007-15 |
Device Orientation for QFN-12/QFN-16 |
| PACK-0007-5 |
Device Orientation for SOT23-8L (t1) |
| PACK-0007-6 |
Device Orientation for MSOP, SOIC, SSOP, and TSSOP (T1) |
| PACK-0007-8/9 |
Device Orientation for SC70-6L, SC89-6L, TSOP-6 (Single, Dual, Complementary or Dual Symmetrical) (T1) |
| PACK-0012 |
Device Orientation for PLCC-20/28/44 (T1) |
| PACK-0023-4 |
Device Orientation for Analog ICs, MICRO FOOT 3x2: 0.5-mm Pitch, 0.165-mm Bump Height (T1) |
| PACK-0023-7 |
Device Orientation for Analog ICs, MICRO FOOT 3x3: 0.5-mm Pitch, 0.238-mm Bump Height (T5) |
| PACK-0023-9 |
Device Orientation for Analog ICs, MICRO FOOT 3x3: 0.5-mm Pitch, 0.238-mm Bump Height (T1) |
| Tape Information |
Tape Drawing for PowerPAK®, MLP(QFN), 4 x 4/3 x 3, DFN-10, 3 x 3, MLP33-8/10 |
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SPICE
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| Spice Model (pdf) | |||||
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