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Vishay Electro-Films

Vishay Electro-Films is a leader in the manufacturing of thin film components, networks, and arrays on ceramic and silicon, including resistors, capacitors, inductors, and microwave components. It specializes in thin film resistive products using tantalum nitride. Vishay Electro-Films products complement Vishay's other thin film products and have further improved Vishay's status as a global leader in thin film technology. Products branded Vishay Electro-Films include linear resistors, capacitors, capacitor arrays, and inductors. High-quality, patterned thin-film substrates are produced in volume for both the hybrid circuit and microwave industries, and these products are used in both military and industrial hybrid circuit applications.

Vishay Electro-Films' expertise in engineering and manufacturing these products has evolved into the expertise necessary to engineer high-density multilayer products, flip chip, and ball grid array technologies and specific application-orientated devices. New to the range is a thin film back-contact resistor chip that requires only one wire bond, thus saving space. The second electrical connection is made through the back of the chip. The product has a smaller footprint than alternative configuration chip resistors and is ideal for hybrid packages.


CHIP RESISTORS
TOP CONTACT - Single Value

Top Contact chip resistors are available in Silicon, Ceramic, or Quartz substrates. Chips are typically manufactured with wiredbondable terminations in Au or Al, with options for backside metallization. Chips range in size from 20x10 to 120x60.

SILICON
Product Page Datasheet
MSFM
PWA
PWB
SC3
SC7
SCB
SFM
SFP
SFX
TSFM
CERAMIC
Product Page Datasheet
CC1
CC2
CC3
CC4
CC5
CC6
CC7
CC8
CCB
CCC
SFC
QUARTZ
Product Page Datasheet
QFM
QFN
QFX
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NETWORKS, DIVIDERS, BACK CONTACT

Vishay EFI thin film networks and arrays are wire-bondable and are available in silicon and ceramic substrates.

Resistor dividers are center-tapped and also available in custom value pairing.

Back Contact resistors come with wire-bondable terminations

NETWORKS / ARRAYS
Product Page Datasheet
CLA/CLB/CLC
MTLP
MTR
MTT
SLR
CENTER-TAPPED / DIVIDERS
Product Page Datasheet
CTA
CTM
CTN
CTQ
CTR
CTT
DTR
SC3
SC7
SCB
STR
BACK CONTACT
Product Page Datasheet
BCR
IGBR
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MICROWAVE, HIGH POWER, HIGH TEMP

Vishay EFI Microwave products are available with wirebondable or solderable terminations and are also available in standard and microwave trim.

High power products are wire-bondable and available in top contact and back contact versions

High Temperature products are available in single value or as a divider

MICROWAVE
Product Page Datasheet
MIB
MIC
MID
MIF
MTLP
TMR
HIGH POWER
Product Page Datasheet
IGBR
PWA
PWB
HIGH TEMP
Product Page Datasheet
TCTR
TSFM
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CHIP CAPACITORS
TOP CONTACT - Single Value, BINARY, RESISTOR/CAPACITOR NETWORKS

Vishay EFI Capacitors are available as MOS or MNOS in single value, binary, or in a resistor/capacitor network combination. A special Bar Capacitor is also available.

TOP CONTACT - SINGLE VALUE
Product Page Datasheet
NCAA
NCBB
NCCC
NCDD
NCEE
RES / CAP NETWORKS, MICROWAVE
Product Page Datasheet
RCN
RFCS
SPECIAL, BINARY
Product Page Datasheet
BRCP
CBA
CBB
CBC
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CHIP INDUCTORS
Ceramic, Quartz

Vishay EFI Inductors are made from ceramic or quartz and can be used in high frequency applications.

CERAMIC
Product Page Datasheet
PSC
QUARTZ
Product Page Datasheet
RFLW 3N
RFLW 5N
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Vishay EFI offers build-to-print custom ceramic solutions with a wide variety of available substrates, metal stacks, and manufacturing capabilities addressing the most complicated designs. In addition to Alumina, EFI offers high power substrate options such as Aluminum Nitride and Berylium Oxide. Other substrates include Silicon, Quartz, Ferrites, Titantes and Sapphire. Metal schemes can include Titanium-Tungsten, Nickel, Gold, Aluminum, Chrome, Copper, with resistive layers of Tantalum Nitride or Nickel Chromium.

Vishay EFI offers plated metal options for wirebonding as well as deposited solder pads of AuSn.

Utilizing proprietary Side-Wall Patterning manufacturing methods, Vishay EFI can pattern, plate, apply AuSn and integrate resistors to 4 sides of a substrate, wrapping inclusive.

Please see the available design guidelines and contact Vishay EFI below if a custom solution would best fit your needs.

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SUBMIT AN RFQ
If you would like a design quoted or reviewed, you can submit an RFQ by using the section below.
Please add your comments, include RFQ quantity, any price and lead time information you want considered: Email: efi@vishay.com
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SUPPORTING INFORMATION
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DATABOOKS
Title Document
Databook Thin Film Products
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ADDITIONAL INFORMATION
Title Document
Waffle Pack Information
Tape and Reel
S-Parameter
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REGULATORY INFORMATION
Title Document
ISO 9001:2008
ISO 14001:2004
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Contacts
For technical question, contact efi@vishay.com
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