Shear Modulus Sensors are specifically designed
to accommodate the unique specimen geometries and
strain-field distributions encountered when testing
composite materials for shear properties. Two popular
specimens for in-plane shear modulus testing of
composites are the losipescu and compact designs. The
test section for both types is described as the area
between two opposing notches. The Iosipescu specimen
has a distance between the notch roots of 0.45 in
(11.4 mm); for the compact design this distance is
0.75 in (19 mm). Both of these specimens have an
inherently nonuniform shear-strain distribution in
their test zone. Determining shear modulus requires
extracting an average shear-strain value from this
nonuniform strain field. Since strain gages have the
unique characteristic of integrating the surface
strain field under their grids, average specimen
strain is automatically obtained by spanning the
entire length of either specimen's test section.
Two 500-ohms ±0.4%, ±45° shear-gage
configurations are available for both the Iosipescu
and compact specimen designs.
The planar configuration, with side-by-side grids,
is constructed with a standard N2 backing and Option
SP61 (beryllium-copper lead ribbons and polyimide
film encapsulation). The stacked configuration is
produced with a special backing, A2. This backing is
similar to N2 but is fully encapsulated with a
polyimide film and includes integral beryllium-copper
lead ribbons (like those provided by Option SP61).
The stacked configuration is offered to best simulate
strain measurement at a point. The stacked gages are
supplied in a quarter-bridge arrangement so that
independent gage measurements can be made if
necessary. When connected in a half-bridge circuit,
the stacked construction inherently provides
temperature compensation and insensitivity to normal
strains. Due to the increased stiffness of a stacked
sensor, compared to one having only a single layer,
an evaluation of the test conditions and requirements
should be made to ensure that the gage will not
compromise accuracy by significantly reinforcing
low-modulus and/or thin specimens. |