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Strain Gage Accessories

Bondable Terminals


Backing Materials

Type PF
Polyimide film: 0.003 in (0.08 mm) thick.

( Shown here with C-pattern terminals .)

This is the preferred general-purpose backing material. It is more flexible and conformable than the Type EG (below); although not as strong. Type PF backing combines high-temperature capability, resistance to soldering damage and good electrical properties. It is suitable for long-term use at +450° to +500°F (+230° to +260°C), limited primarily by gradual oxidation of the copper foil interface. The relatively high thermal expansion coefficient of unfilled polyimide can cause loss of bond at temperatures below -100°F (-75°C).

Type EG
Epoxy-glass laminate: 0.005 in (0.13 mm) thick.

( Shown here with S-pattern terminals .)

This special laminate provides a strong but flexible backing for terminals. It is suitable for long-term use at +300°F (+150°C), and is recommended for cryogenic applications at temperatures down to -452°F (-269°C). The radius of curvature of the mounting surface should generally be greater than 1/8 in (3 mm).


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