M-Bond 450 Adhesive
Description
High-performance, two-component, solvent-thinned
epoxy system specially formulated for high
accuracy, elevated-temperature transducer
applications. M-Bond 450 is compatible with all
Micro-Measurements strain gage series.
M-Bond 450 Kit
Cure
Requirements
Step 1
: Air dry at +75°F (+24°C) for 10 to 30
minutes
B-Stage
: +225°F (+105°C) for 30 minutes
Cure
: +350°F (+175°C) for 1 hour
Recommended Postcure
: 1 hour at 50°F (30°C) above the maximum
operating temperature in 50°F (30°C)
increments from +350°F (+175°C), dwelling
1 hour at each step.
Operating
Temperature Range
Short Term
: -452° to +750°F (-269° to
+400°C)
Long Term
: -452° to +500°F (-269° to
+260°C)
Elongation
Capabilities
>5% at +75°F (+24°C)
Shelf Life
*
6 months at +75°F (+24°C)
Pot Life
6 weeks at +75°F (+24°C)
Clamping
Pressure
60 to 100 psi (415 to 690 kN/m
2
)
Instruction
Manual
B-152
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