Description
Two-component, solvent-thinned, epoxy-phenolic adhesive for high-performance applications, including high-precision transducers. Solids content 22%. Widest temperature range general-purpose adhesive available. Low viscosity, capable of gluelines <0.0002 in (0.005 mm). Extremely thin, hard, void-free gluelines minimize creep, hysteresis, and linearity problems. Life limited by oxidation and sublimation effects at elevated temperatures.

M-Bond 610 Kit

Cure Requirements
Elevated temperature required.

Operating Temperature Range
Short Term: -452° to +700°F (-269° to +370°C)
Long Term: -452° to +500°F (-269° to +260°C)
Transducers: to +450°F (+230°C)

Elongation Capabilities
1% at -452°F (-269°C)
3% at +75°F (+24°C)
3% at +500°F (+260°C)

Shelf Life *
9 mo at +75°F (+24°C)
15 mo at +40°F (+5°C)

Pot Life
6 weeks at +75°F (+24°C)
12 weeks at +40°F (+5°C)

Clamping Pressure
10 to 70 psi (70 to 480 kN/m ² )
30 to 40 psi (200 to 275 kN/m ² )

Instruction Manual
B-130

• M-Bond 610 Kit (as shown above) with 4 bottles (14g each) Resin, 4 bottles (11g each) Curing Agent, 4 brush caps for dispensing mixed adhesive, 4 disposable mixing funnels.