Description
Two-component, 100% solids epoxy system for general-purpose stress analysis. Transparent, medium viscosity. A cure time as low as six hours at +75°F (+24°C) may be used. ( AE-15 is recommended for more critical applications, including transducers.) Elevated-temperature postcure is recommended for maximum stability, and/or tests above room temperature. Highly resistant to moisture and most chemicals, particularly when postcured. For maximum elongation, bonding surface must be rough. Cryogenic applications require very thin gluelines.

M-Bond AE-10 Kit

Cure Requirements
Preferred Room-Temperature Cure : 24-48 hours at +75°F (+24°C)

Operating Temperature Range
Long Term: -320° to +200°F (-195° to +95°C)

Elongation Capabilities
1% at -320°F (-195°C)
6% to 10% at +75°F (+24°C)
15% at +200°F (+95°C)

Shelf Life *
12 months at +75°F (+24°C)
18 months at +20°F (-7°C)
If crystals form in resin bottle, heat to +120°F (+50°C) for 30 minutes. Cool before mixing.

Pot Life
15 to 20 minutes at +75°F (+24°C)
Can be extended by cooling jar or by spreading adhesive on clean aluminum plate.

Clamping Pressure
5 to 20 psi (35 to 140 kN/m ² )

Instruction Manual
B-137

• M-Bond AE-10 Kit (as shown above) with 6 mixing jars (10 g each) Resin, 1 bottle (15ml) Curing Agent 10, 6 calibrated pipettes, 6 stirring rods.
  
• M-Bond AE-10 Bulk includes of 200 g Resin, 40 g Curing Agent 10, 3 calibrated pipettes.