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Micro-Measurements
Strain Gage Accessories



M-Bond AE-15 Adhesive

Description
Two-component, 100% solids epoxy system for general-purpose stress analysis. Transparent, medium viscosity. A cure time as low as six hours at +125°F (+50°C) may be used. AE-15 is recommended over AE-10 for more critical applications, including transducers. Elevated-temperature postcure is recommended for maximum stability, and/or tests above room temperature. Highly resistant to moisture and most chemicals, particularly when postcured. For maximum elongation, bonding surface must be rough. Cryogenic applications require very thin gluelines.


M-Bond AE-15 Kit

Cure Requirements
Elevated temperature required .


Recommended Postcure : 2 hours at 25°F (15°C) above the maximum operating temperature.
Optimum Performance Transducer Postcure : 1 hour at +200°F (+95°C)


Operating Temperature Range
Long Term: -452°F to +200°F (-269° to +95°C)
Transducers: to +175°F (+80°C)

Elongation Capabilities
2% at -320°F (-195°C)
10% to 15% at +75°F (+24°C)
15% at +200°F (+95°C)

Shelf Life *
12 months at +75°F (+24°C)
18 months at +20°F (-7°C)
If crystals form in resin bottle, heat to +120°F (+50°C) for 30 minutes. Cool before mixing.

Pot Life
1.5 hours at +75°F (+24°C)

Clamping Pressure
5 to 20 psi (35 to 140 kN/m 2 )

Instruction Manual
B-137


Ordering Information
  • M-Bond AE-15 Kit (as shown above) with 6 mixing jars (10 g each) Resin, 1 bottle (15ml) Curing Agent 15, 6 calibrated pipettes, 6 stirring rods.
  • M-Bond AE-15 Bulk includes 200g Resin, 25g Curing Agent 15, 3 calibrated pipettes.

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