Description
Two-component, partially filled, 100%-solids epoxy system for general-purpose stress analysis. Higher viscosity than AE-10 or AE-15 systems. Elevated-temperature cure recommended for best performance and resistance to chemical attack. Often used to fill irregular surfaces. Uneven gluelines easily detectable by nonuniformity of bond color.

M-Bond GA-2 Kit

Cure Requirements
Preferred Room-Temperature Cure : 40 hours at +75°F (+24°C)

Operating Temperature Range
Long Term: -320° to +200°F (-195°to +95°C)

Elongation Capabilities
4% at -320°F (-195°C)
10% to 15% at +75°F (+24°C) after 40-hour room-temperature cure or 6-hour room-temperature cure with postcure
15% to 20% at +200°F (+95°C)

Shelf Life *
12 mo at +75°F (+24°C)
18 mo at +20°F (-7°C)

Pot Life
15 minutes at +75°F (+24°C)
Can be extended by cooling jar or by spreading adhesive on clean aluminum plate.

Clamping Pressure
5 to 20 psi (35 to 140 kN/m ² )
The black filler provides a visual indication of nonuniform bond areas caused by uneven clamping pressure.

Instruction Manual
B-137

• M-Bond GA-2 Kit (as shown above) with 6 mixing jars (15 g each) Resin, 1 bottle (15 ml) Curing Agent, 6 calibrated pipettes, 6 stirring rods.