Description
Two-component, partially filled, 100%-solids epoxy adhesive for general-purpose stress analysis. Very high viscosity. Widely used to fill irregular surfaces and to anchor leadwires. Forms a very hard, chemical-resistant material when fully cured. Glueline thickness is generally <0.002 in (<0.05 mm).

M-Bond GA-61 Kit

Cure Requirements
Elevated-temperature cure required.

Operating Temperature Range
Short Term: -100° to +600°F (-75° to +315°C)
Long Term: -100° to +500°F (-75° to +260°C)

Elongation Capabilities
1% at -100°F (-75°C)
2% at +75°F (+24°C)
1% at +500°F (+260°C)

Shelf Life *
12 mo at +75°F (+24°C)
18 mo at +40°F (+5°C)

Pot Life
10 hours at +75°F (+24°C); increased by refrigeration.

Clamping Pressure
10 to 30 psi (70 to 200 kN/m ² )

Instruction Manual
B-128

• M-Bond GA-61 Kit (as shown above) with 3 jars (10 g each) Resin, 3 jars (5 g each) Hardner, 3 stirring rods.