M-Bond 43-B
Description
Solvent-thinned (MEK and xylene) single-component
epoxy resin compound. Primarily used as
adhesive
. Cured coating 0.002-0.01 in (0.05-0.25 mm) thick.
Provides excellent chemical, electrical, and
mechanical properties when fully cured. Film is
hard, with high heat-distortion temperature.
Excellent in transducer service.
M-Bond 43-B Kit
Cure
Requirements
Air-dries in about 10 minutes at +75°F
(+24°C). Minimum cure 2 hours at +325°F
(160°C). Preferred cure 2 hours at +375°F
(190°C).
Operating
Temperature Range
Short Term: -452° to +400°F (-269°
to +205°C)
Long Term: -452° to +275°F (-269° to
+135°C)
Shelf Life
*
9 months at +75°F (+24°C)
18 months at +40°F (+5°C)
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