MR-Series Bridge Completion Modules employ metal-foil resistance elements, bonded to a dense ceramic substrate. The resistance elements are specially processed to "match" the thermal expansion coefficient of the ceramic, resulting in a very low resistance temperature coefficient equivalent to ±0.15 microstrain/°F (±0.27 microstrain/°C) for the half-bridge circuits, and ±0.35 microstrain/°F (±0.63 microstrain/°C) for the dummy gages, over a temperature range from 0° to +200 °F (-18° to +95°C). Maximum operating temperature range is -50° to +250°F (-45° to +120°C).

Each module is covered with a special environmental protective system to ensure long-term stability. A rugged aluminum overlay, embossed with a wiring diagram for easy terminal identification, affords additional protection, and in many applications no supplementary environmental protection is required. Each module is provided with foam tape for easy attachment to the test-part surface or at the instrumentation site, and tinned, heavy copper terminals facilitate attachment of up to 22-gauge (0.64 mm dia.) leadwires.

Half-bridge circuits in each module type are balanced to within ±0.005%. Resistance tolerance on each dummy gage is ±0.02%.