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Surface Preparation for Strain Gage Bonding

Surfaces Requiring Special Treatment

Plated Surfaces

In general, plated surfaces are detrimental to strain gage stability, and it is preferable to remove the plating at the gage location, if this is permissible. Cadmium and nickel plating are particularly subject to creep, and even harder platings may creep because of the imperfect bond between the plating and the base metal. When it is not permissible to remove the plating, the surface should be prepared according to the procedure given in the Index of Test Materials and Surface Preparation Procedures for the specific plating involved. Note that it may be necessary to adjust testing procedures to minimize the effects of creep.



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