Bridge Completion Modules Micro-Measurements MR-Series Bridge Completion Modules (BCM's) were introduced in 1989. Since then, they have become the preferred method of bridge completion at the gage site when temperature compensation within the bridge is not required. Even more insensitive to temperature than precision resistors, they are certainly the easiest to install. These networks of matched resistive grids come ready for use with quarter and/or half bridges of active gages. Their integral solder tabs minimize the number of solder connections required to complete the circuit, while a foam tape attaches each BCM to the test part. This foam decouples the BCM from any strains present in the underlying surface. While the subject of external bridge completion is too broad to adequately cover here, much more detailed information is available in the technical literature. The Tech Notes on thermal output in strain gages (TN-504, Strain Gage Thermal Output and Gage Factor Variation with Temperature ) and noise in strain gage circuits (TN-501, Noise Control in Strain Gage Measurements ) are particularly useful in this regard. And, as always, our Applications Engineering Department will be pleased to help you select the right compensating strain gage, precision resistor, or bridge completion module for your particular strain measurement application.   Page 4 of 4