Measurement of Residual Stresses by the
Hole-Drilling
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Strain Gage Method
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Introduction
Residual Stresses and Their Measurement
Residual (locked-in) stresses in a structural
material or component are those stresses which exist
in the object without (and usually prior to) the
application of any service or other external loads.
Manufacturing processes are the most common causes of
residual stress. Virtually all manufacturing and
fabricating processes -- casting, welding, machining,
molding, heat treatment, etc. -- introduce residual
stresses into the manufactured object. Another common
cause of residual stress is in-service repair or
modification. In some instances, stress may also be
induced later in the life of the structure by
installation or assembly procedures, by occasional
overloads, by ground settlement effects on
underground structures, or by dead loads which may
ultimately become an integral part of the structure.
The effects of residual stress may be either
beneficial or detrimental, depending upon the
magnitude, sign, and distribution of the stress with
respect to the load-induced stresses. Very commonly,
the residual stresses are detrimental, and there are
many documented cases in which these stresses were
the predominant factor contributing to fatigue and
other structural failures when the service stresses
were superimposed on the already present residual
stresses. The particularly insidious aspect of
residual stress is that its presence generally goes
unrecognized until after malfunction or failure
occurs.
Measurement of residual stress in opaque objects
cannot be accomplished by conventional procedures for
experimental stress analysis, since the strain sensor
(strain gage, photoelastic coating, etc.) is totally
insensitive to the history of the part, and measures
only
changes
in strain
after
installation of the sensor.
In order to measure residual stress with these
standard sensors, the locked-in stress must be
relieved in some fashion (with the sensor present) so
that the sensor can register the change in strain
caused by removal of the stress. This was usually
done destructively in the past -- by cutting and
sectioning the part, by removal of successive surface
layers, or by trepanning and coring.
With strain sensors judiciously placed before
dissecting the part, the sensors respond to the
deformation produced by relaxation of the stress with
material removal. The initial residual stress can
then be inferred from the measured strains by
elasticity considerations. Most of these techniques
are limited to laboratory applications on flat or
cylindrical specimens, and are not readily adaptable
to real test objects of arbitrary size and shape.
X-ray diffraction strain measurement, which does not
require stress relaxation, offers a nondestructive
alternative to the foregoing methods, but has its own
severe limitations. Aside from the usual bulk and
complexity of the equipment, which can preclude field
application, the technique is limited to strain
measurements in only very shallow surface layers.
Although other nondestructive techniques (e.g.,
ultrasonic, electromagnetic) have been developed for
the same purposes, these have yet to achieve wide
acceptance as standardized methods of residual stress
analysis.
*
Drilling implies all methods of introducing
the hole (i.e., drilling, milling, air abrasion,
etc).
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