High Force-Field Applications

High g-fields create high unbonding forces between the copper terminal and backing material . When printed-circuit terminals must be used in this type of application, keep the solder and leadwire mass to a minimum. Whenever possible, locate the terminal strip so that the centrifugal force is either parallel to the plane of the terminal, or in a perpendicular direction which will assist in keeping the terminal in place. Refer to Vishay Measurements Group Tech Tip TT-601, Techniques for Bonding Leadwires to Surfaces Experiencing High Centrifugal Forces relating to techniques for bonding leadwires to surfaces experiencing high centrifugal forces.

Page 10 of 12