Bonding

M-Bond 600 and M-Bond 610 are the strain gage adhesives generally recommended for high-performance applications. However, any M-Bond adhesive can be used where temperature conditions and other factors permit. Although Micro-Measurements strain gage adhesives are not particularly fatigue sensitive, some potential problem areas are:

• Adhesive failure due to improper surface preparation or environmental protection.
• Voids or air bubbles in the glueline, causing "hot spots" in the gage and subsequent premature failure.
  

Wherever possible, the use of bondable terminals is recommended to provide an anchor for the instrument leadwire, preventing damage to the gage when the leadwire is subjected to any type of force. Micro-Measurements Type CPF-75C terminals are particularly suitable for this application within their operating temperature range. If bonded in a high strain field, terminals should be cut in half and/or bonded 90 deg to the maximum strain direction. The figure above is representative of typical installations.

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