Brands     Vishay Measurements Group     Interactive Guide     Tech Tips     TT-605


High-Elongation Strain Measurements
Recommended M-LINE Adhesives

See Micro-Measurements Catalog A-110 for complete specifications.

M-Bond AE-15

General Description
Two-component, 100%-solids epoxy system. Moderately elevated temperature cure. Transparent, medium-viscosity adhesive.

Preferred Cure
2 hours at +150 deg F (+65 deg C)

Elongation Capabilities

  • -320 deg F (-195 deg C)   2%
  • +75 deg F (+24 deg C)   15%
  • +200 deg F (+95 deg C)   15%


Reference Table