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High-Elongation Strain Measurements
Recommended M-LINE Adhesives

See Micro-Measurements Catalog A-110 for complete specifications.

M-Bond GA-2

General Description
Two-component, partially filled, 100%-solids epoxy system. May be cured at room temperature. Higher viscosity than AE system.

Preferred Cure
6 hours at +75 deg F (+24 deg C) followed by 1 hour at +125 deg F (+50 deg C)

Elongation Capabilities

  • -320 deg F (-195 deg C)   4%
  • +75 deg F (+24 deg C)   10 - 15%
  • +200 deg F (+95 deg C)   15 - 20%


Reference Table