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Soldering Techniques for Lead Attachment
to Strain Gages with Solder Dots

Introduction

Many gages are now purchased with integral solder dots. These offer advantages of accurately controlled solder joint size, convenience when working in confined areas, and of having pretinned "hard-to-solder" alloys such as Iso-elastic and Karma . Controlled joint size, in turn, helps to increase gage fatigue life, and minimizes thermocouple effects.

If proper installation techniques are used, there should be no difficulty experienced in obtaining well-soldered connections; but care must be exercised. Open-faced gages with Option S (solder dots only) should be coated with adhesive at the time of installation. Such encapsulation effectively prevents dot enlargement and undesirable spreading during subsequent soldering steps. To expose the dots, lightly abrade with 400-grit silicon-carbide paper or simply solder through this overcoat. Encapsulated gages do not require additional coating with adhesive.

The following pages are important guidelines.



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