Vishay Launches First Power MOSFETs to Combine WFET™ and TrenchFET® Gen II Technologies for Exceptionally Low 6.5 nC Qgd and 3.6 mΩ rDS(on) Values

SANTA CLARA, CALIFORNIA - May 10, 2004 - Siliconix incorporated (NASDAQ: SILI), an 80.4%-owned subsidiary of Vishay Intertechnology, Inc. (NYSE: VSH), today announced the release of the first two power MOSFETs to combine the extremely low Q_gd values enabled by WFET™ technology with the very low r_DS(on) values of TrenchFET® Gen II technology.

The two power MOSFETs released today are designed for low-side operation in synchronous buck (single- and multi-phase configurations) dc to dc converters in notebook PCs, servers, and VRM modules, as well as in synchronous rectification in fixed telecom systems.

The new Si4368DY (PowerPAK® SO-8) and Si7668DP (SO-8) feature on-resistance of 3.6 mΩ (at 4.5-V max.) and a low r_DS(on)-times-Q_gd value of 23 mΩnC for improvements of 25% and 54%, respectively, over specifications for competing MOSFET devices. Both devices provide an exceptionally low Q_gd/Q_gs ratio of 0.37 - also 54% better than competing devices - to ensure high “shoot-thru” immunity and to help keep Q_g in check for reduced switching losses and more efficient dc-to-dc converter performance. The maximum gate threshold voltage for the Si4368DY and Si7668DP is 1.8 V. Packaged in the thermally enhanced PowerPAK SO-8 package, the Si7668DP also offers lower thermal resistance and greater power dissipation.

Vishay’s innovative WFET technology uses a thicker gate oxide at the bottom of the devices’ silicon trench to reduce C_rss and Q_gd with minimal impact on r_DS(on) performance, boosting the efficiency of dc-to-dc converters. With the release of the new devices, designers can now build an all-WFET dc-to-dc converter using the Si4368DY or Si7668DP on the low side and the previously announced Si4390DY or Si7390DP on the high side. The WFET power MOSFETs’ low conduction and switching losses translate directly into a 2% improvement in dc-to-dc converter efficiency over competing solutions in typical applications.

By applying WFET technology to its latest high-density silicon in the Si4368DY and Si7668DP, Vishay achieves a transistor density of 300 million cells per square inch and a low specific on-resistance of 12 mΩ/mm² without compromising switching performance. As a result, the new devices enable design of faster, lighter, smaller, cooler, more efficient, and longer-running products with more robust feature sets.

All WFET power MOSFETs are 100% R_g-tested to ensure that devices perform as specified in high-frequency dc-to-dc applications.

Samples and production quantities of the new WFET TrenchFET Gen II power MOSFETs are available now, with lead times of 10-12 weeks for larger orders.

Vishay Intertechnology, Inc., a Fortune 1,000 Company listed on the NYSE (VSH), is one of the world's largest manufacturers of discrete semiconductors (diodes, rectifiers, transistors, and optoelectronics and selected ICs) and passive electronic components (resistors, capacitors, inductors, sensors, and transducers). These components are used in virtually all types of electronic devices and equipment, in the industrial, computing, automotive, consumer, telecommunications, military, aerospace, and medical markets. Its product innovations, successful acquisition strategy, and ability to provide "one-stop shop" service have made Vishay a global industry leader. Vishay can be found on the Internet at http://www.vishay.com.