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Die & Wafer - HEXFRED® Die Gen 2

If you have questions or require additional information on these die / wafer products, please contact us via e-mail at die-wafer@vishay.com

Part Number
Optimized For
Gen
IF (AV)
(A)
VR
(V)
VF Max. @ 25 °C
(V)
Trr Typ. @ 25 °C
(ns)
Die Size
(mils)
Front Side Metal
Back Side Metal
Tj Max.
(°C)
Die Thickness
(mils)
Wafer Diameter
(inches)
VS-H2066H06A6x BOOST Diode 2 4 600 1.8 41 66 x 66 Bondable Solderable 150 14.8 6
VS-H2085H06A6x APD 2 12 600 1.7 47 85 x 164 Bondable Solderable 150 14.8 6
VS-H2090H06A6x BOOST Diode 2 8 600 1.7 41 90 x 90 Bondable Solderable 150 14.8 6
VS-H2107H12A6x BOOST Diode 2 6 1200 3 58 107 x 130 Bondable Solderable 150 14.8 6
VS-H2115H06A6x BOOST Diode 2 15 600 1.7 47 115 x 155 Bondable Solderable 150 14.8 6
VS-H2115H12A6x BOOST Diode 2 8 1200 3.3 59 115 x 155 Bondable Solderable 150 14.8 6
VS-H2169H06A6x BOOST Diode 2 25 600 1.7 53 169 x 220 Bondable Solderable 150 14.8 6
VS-H2169H12A6x BOOST Diode 2 16 1200 3 69 169 x 220 Bondable Solderable 150 14.8 6
VS-H2195H06A6x APD 2 30 600 1.2 @ 12 A 62 195 x 340 Bondable Solderable 150 14.8 6
VS-H2195H12A6x APD 2 30 1200 3 @ 16 A 78 195 x 340 Bondable Solderable 150 14.8 6
VS-H2200H04A6x APD 2 60 400 1.2 57 200 x 200 Bondable Solderable 150 14.8 6
VS-H2200H06A6x APD 2 60 600 1.7 @ 70 A 52 200 x 200 Bondable Solderable 150 14.8 6
VS-H2257H06A6x APD 2 80 600 1.2 @ 10 A 62 257 x 257 Bondable Solderable 150 14.8 6
VS-H2257H12A6x APD 2 80 1200 3 @ 16 A 78 257 x 257 Bondable Solderable 150 14.8 6