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Die & Wafer - HEXFRED® Die Gen 3

If you have questions or require additional information on these die / wafer products, please contact us via e-mail at die-wafer@vishay.com

Part Number
Optimized For
Gen
IF (AV)
(A)
VR
(V)
VF Max. @ 25 °C
(V)
Trr Typ. @ 25 °C
(ns)
Die Size
(mils)
Front Side Metal
Back Side Metal
Tj Max.
(°C)
Die Thickness
(mils)
Wafer Diameter
(inches)
VS-H3051D05A6x APD 3 1 600 1.75 @ 3 A 52 51 x 51 Bondable Solderable 150 14.8 6
VS-H3065D06A6x APD 3 3 600 1.35 @ 1 A 56 65 x 66 Bondable Solderable 150 14.8 6
VS-H3075D06A6x APD 3 5 600 1.1 @ 1 A 57 75 x 76 Bondable Solderable 150 14.8 6
VS-H3085D06A6x APD 3 15 600 1.15 @ 3 A 61 85 x 131 Bondable Solderable 150 14.8 6
VS-H3090D12A6x APD 3 5 1200 1.95 @ 2 A 50 90 x 91 Bondable Solderable 150 12 6
VS-H3107D12A6x APD 3 8 1200 1.58 @ 2.5 A 51 107 x 130 Bondable Solderable 150 12 6
VS-H3115D12A6x APD 3 15 1200 2 @ 5 A 52 115 x 155 Bondable Solderable 150 12 6
VS-H3135D06A6x APD 3 30 600 1.2 @ 5 A 68 135 x 135 Bondable Solderable 150 14.8 6
VS-H3169D12A6x APD 3 25 1200 1.5 @ 5 A 60 169 x 220 Bondable Solderable 150 12 6
VS-H3169E12A6x APD 3 25 1200 1.8 @ 5 A 54 169 x 220 Bondable Solderable 150 12 6
VS-H3171D06A6x APD 3 50 600 1.1 @ 5 A 69 171 x 171 Bondable Solderable 150 14.8 6
VS-H3195D12A6x APD 3 50 1200 1.3 @ 5 A 72 195 x 340 Bondable Solderable 150 12 6
VS-H3230D06A6x APD 3 100 600 1 @ 5 A 73 230 x 231 Bondable Solderable 150 14.8 6
VS-H3234D12A6x APD 3 75 1200 1.2 @ 5 A 82 234 x 443 Bondable Solderable 150 12 6
VS-H3257D12A6x APD 3 50 1200 1.3 @ 5 A 74 257 x 257 Bondable Solderable 150 12 6
VS-H3356D06A6x APD 3 240 600 1.1 @ 5 A 90 356 x 356 Bondable Solderable 150 14.8 6
VS-H3357D12A6x APD 3 100 1200 1.2 @ 5 A 85 357 x 357 Bondable Solderable 150 12 6