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Die wafer - Infrared emitting diodes


Die wafer - Infrared emitting diodes
Part Number
Package Type
Package Form
Package Dimensions
(L x W x H)
(mm)
Peak Wavelength
(mm)
Radiant Power
(mW)
Angle of Half Intensity
()
Rise Time
(ns)
Datasheet
info
chip chip 0.2 x 0.2 x 0.19 940 3.5 80 15
Datasheet
info
chip chip 0.37 x 0.37 x 0.19 940 21 80 15
Datasheet
info
chip Chip 0.355 x 0.355 x 0.17 855 60 10
Datasheet
info
chip Chip 0.260 x 0.260 x 0.17 940 60 10
Datasheet
info
chip Chip 0.355 x 0.355 x 0.17 940 60 10