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Die wafer - Infrared emitting diodes

Part number
Package Type
Package Form
Package Dimensions (L x W x H)
(mm)
Peak Wavelength
(nm)
Radiant Intensity
(mW/sr)
Angle of Half Intensity
(±°)
Rise Time
(ns)
Datasheet
info
Chip 0.37 x 0.37 x 0.265 950 1.2 0 800
Datasheet
info
chip Chip 0.37 x 0.37 x 0.17 850 3.3 80 25
Datasheet
info
chip Chip 0.37 x 0.37 x 0.16 865 4.2 80 13
Datasheet
info
chip Chip 0.47 x 0.47 x 0.16 870 5.8 80 15
Datasheet
info
chip Chip 0.37 x 0.37 x 0.17 885 3.7 80 25
Datasheet
info
chip Chip 0.37 x 0.37 x 0.19 940 4.3 80 15
Datasheet
info
chip Chip 0.508 x 0.508 x 0.17 850 7.5 55 15
Datasheet
info
chip Chip 1.066 x 1.066 x 0.17 850 7.5 55 15