Markings (3)
  Package Drawing (2)
  Technical Note (1)
  SPICE (5)

Markings
Device Marking	PDD Marking
Part Marking Information	TO-247, TO-247 modified
Part Marking Information	TO-247

Package Drawing
Outline Dimensions	TO-247, TO-247 modified
Outline Dimensions	TO-247

Technical Note
Soldering & Pad Layout	Pad layouts/Soldering Process

SPICE
P-SPICE	SPICE3
FEP30GP  FEP30JP	FEP30GP  FEP30JP  UG30DPT