************************************************* * Copyright 2020 © Vishay Intertechnology, Inc. * * All rights reserved. * ************************************************* *July 30, 2021 *DD Vishay semiconduttori italiana SPA *davide.dapra@vishay.com *File Name: BYG23T.txt *This document is intended as a SPICE modeling guideline and does not *constitute a commercial product datasheet. Designers should refer to the *appropriate datasheet of the same number for guaranteed specification *limits. *Model fit device at 25°C *DEVICE=BYG23T,D **************************************************** .MODEL BYG23T D + IS=0.002038 + N=19.89 + RS=.183 + IKF= 1.86 + CJO=21.777E-12 + M=.37364 + VJ=.38959 + EG=1.11 + ISR=1.00E-12 + XTI=2.2 + BV=1.4951E3 + IBV=2.8862 + TT=160.31E-9 .ENDS