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Hybrid Circuit Substrates product information

High-Power Multi-Tiered Conductor Hybrid Circuit Substrate

 Hybrid Circuit Substrates Datasheet

FEATURES

  • Copper power lines up to 5000 microinches thick
  • Gold small signal lines 100 microinches width tolerance
  • Temperatures to 350 C


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Documents

Datasheet
Application Notes
Application Note - Cost-effective High Volume Interconnect Thin Film Substrate Solutions
General Information
General Information - 2009 Review of Thin Film North America Products (Vishay Thin Film, Vishay Electro-Films)
Product Literature
Capabilities - AuSn Series - Thin Film Patterned Substrates with Deposited Gold/Tin Pads
Capabilities Brochure - Diode Submount Capabilities Using Thin Film Substrates
Capabilities Brochure - Pattern Substrates Using Thin Film Technology: Vishay Electro-Films Application-Specific Pattern Substrates
Product Sheet - Model HDI: High-Density Interconnects
Reference Data
<!-- -->Characteristics & Capabilities - Patterned Substrate Products
Application Note - Application of High Conductivity Traces in Thin Film
Technical Note - Substrate Design Guidelines
Technical Notes
Technical Note - An Introduction to Substrate PIMIC Technology
Technical Note - Applications and Design of Plated and Filled Via Circuits
Technical Note - Thin Film High-Density Integration (HDI) Design Guidelines
Product Support
Technical Questions
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