Industry-First
Chip Scale Schottky Diodes
FlipKY® Schottky diodes offer a wafer-level, chip
scale format to save space in a wide variety of power management
applications.
The anode and cathode connections are made through solder bump pads
on one side of the silicon, enabling designers to strategically place the
diodes on the PC board. This flip chip design not only minimizes board
space but also reduces thermal resistance and inductance, allowing the
virtual elimination of all package parasitics for improved overall circuit
efficiency.
Their advanced physical design allows FlipKY products to offer
industry-leading specifications in a significantly smaller footprint
compared to standard packages.
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FlipKY Features and Benefits
- FlipKY wafer-level, chip scale format minimizes board space and
reduces thermal resistance and inductance
- Virtual elimination of all package parasitics for improved overall
circuit efficiency
- Footprint of 0.5-A diodes is one-tenth the size of the SMA
footprint
- Footprint of 1.0-A and 1.5-A diodes is one-fifth the size of the SMA
footprint
- Ultra-low forward voltage per footprint area
- Choose either low forward voltage to optimize conduction losses or
low reverse leakage to optimize reverse power losses
- Industry’s smallest footprints of 0.9 mm by 1.2 mm and 1.5 mm
by 1.5 mm
- Ultra-low profile: 0.6 mm for 1-A and 1.5-A devices, 0.5 mm for
0.5-A devices
- Improved working temperature, with full operation at 150 °C
- Supplied in tape and reel format and can be mounted using standard
SMD techniques
- Available with lead (Pb)-free or eutectic solder bumps
FlipKY Applications
A small footprint and very low height profile make
FlipKY Schottky diodes the ideal choice for battery protection,
freewheeling diode, boost diode, and current sensing applications in slim
and space-sensitive portable electronics, including:
- Bluetooth® accessories
- PDAs
- MP3 players
- Digital cameras
- Personal video players
- Mobile phones
- GSM boards, GPS systems
- Other portable electronic systems
Device
Number |
Vrrm (V) |
IF AV (A) |
Ti Max ºC |
Vfm Max @ rated I at 125 ºC
(V) |
IRM @ VRWM
25 ºC (uA) |
IRM @ VRWM
125 ºC (mA) |
EAS |
Rthi-I (ºC/W) |
FCSP0 530TR |
30 |
0,5 |
150 |
0,33 |
50 |
15 |
5 |
150 |
FCSP05H40TR |
40 |
0,5 |
150 |
0,42 |
10 |
2 |
5 |
150 |
FCSP130LTR |
30 |
1 |
150 |
0,33 |
100 |
30 |
10 |
62 |
FCSP140LTR |
40 |
1 |
150 |
0,38 |
80 |
20 |
10 |
62 |
FCSP1H40LTR |
40 |
1 |
150 |
0,42 |
15 |
4 |
10 |
62 |
FCSP230LTR |
30 |
1,5 |
150 |
0,37 |
100 |
30 |
10 |
62 |
FCSP240LTR |
40 |
1,5 |
150 |
0,37 |
100 |
30 |
10 |
62 |
FCSP2H40LTR |
40 |
1,5 |
150 |
0,47 |
15 |
4 |
10 |
62 |
Package Dimensions (in mm)
0.5-A Devices
1-A and 1.5-A Devices
FlipKy® Product Overview
Fort technical support, please contact: diodes-tech@vishay.com
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