Leaded glass package for through-hole assembly

Size: 3.9 mm x 1.7 mm + Lead length: 26 mm

For automated SMD pick and place equipment

Size: 3.5 mm x 1.5 mm

MiniMELF glass package for automated SMD pick and place equipment, squared for improved high speed assembly

Size: 3.5 mm x 1.5 mm

Smallest glass package for automated SMD pick and place equipment, squared for improved high speed assembly

Size: 1.9 mm x 1.25 mm

SMD plastic package

Size: 2.7 mm x 1.55 mm

SMD plastic package (smaller version of SOD-213)

Size: 1.8 mm x 1.3 mm

SMD mold package, ultra-small outline

Size: 1.2 mm x 0.8 mm

SMD for automated pick and place equipment

Size: 2.9 mm x 1.4 mm