Related Documents - 1.2 V rated on-resistance

  General Information (1)
  Markings (5)
  Package Drawings (6)
  Pad Guidelines (10)
  Product Literature (1)
  RC Thermal Models (13)
  Reel Info (1)
  Reliability Data (10)
  Software Models (*.zip) (4)
  Tape Info (16)
  SPICE (34)

General Information [top]
General Information	Useful Links

Markings [top]
PART MARKING	SC-70 for Si Part Numbers
PART MARKING	SC-75A and SC-89 Devices
PART MARKING	SOT-23
Part Marking Information	MICRO FOOTŪ
Part Marking Information	MICRO FOOTŪ 0.8 x 0.8 Devices

Package Drawings [top]
5479	TO-236 (SOT-23)
5550	SC-70 6L
5869	SC-89 3L
5934	PowerPAK SC70-6L
5935	PowerPAK SC75-6L
Package Information	Case Outline for Thin PPAK SC75 Single

Pad Guidelines [top]
AN807	Mounting LITTLE FOOT SOT-23 Power MOSFETs
AN815	Single-Channel LITTLE FOOT SC-70 6-Pin MOSFET-Copper Leadframe Recommended Pad Pattern/Thermal Performance
Application Note 826	RECOMMENDED MINIMUM PADS FOR SC-70: 6-Lead
Application Note 826	RECOMMENDED MINIMUM PADS FOR SC-89: 3-Lead
Application Note 826	RECOMMENDED MINIMUM PADS FOR SoT-23
Application Note 826	RECOMMENDED pad LAYOUT FOR PowerPAKŪ Sc70-6L Dual
Application Note 826	RECOMMENDED PAD LAYOUT FOR PowerPAKŪ SC70-6L Single
Application Note 826	RECOMMENDED pad LAYOUT FOR PowerPAKŪ Sc75-6L Dual
Application Note 826	RECOMMENDED pad LAYOUT FOR PowerPAKŪ Sc75-6L Single
PAD Pattern	MICRO FOOT Products

Product Literature [top]
Product Sheet	1.2 V Rated MOSFETs Product Family

RC Thermal Models [top]
Si1489EDH_RC	R-C Thermal Model Parameters
Si2329DS-GE3_RC	R-C Thermal Model Parameters
Si2342DS_RC	R-C Thermal Model Parameters
Si8416DB_RC	R-C Thermal Model Parameters
Si8469DB_RC	R-C Thermal Model Parameters
Si8802DB_RC	R-C Thermal Model Parameters
Si8805EDB_RC	R-C Thermal Model Parameters
SiA419DJ-RC	RC Thermal Model for SiA419DJ
SiA427ADJ_RC	R-C Thermal Model Parameters
SiA920DJ_RC	R-C Thermal Model Parameters
SiB404DK_RC	R-C Thermal Model Parameters
SiB437EDKT_RC	R-C Thermal Model Parameters
SiB914DK_RC	R-C Thermal Model Parameters

Reel Info [top]
Reel Information	Lok Reel

Reliability Data [top]
Package Reliability	Environmental and Package Testing Data for MICRO FOOTŪ
Package Reliability	Environmental and Package Testing Data for PowerPAKŪ SC-70
Package Reliability	Environmental and Package Testing Data for PowerPAKŪ SC-75
Package Reliability	Environmental and Package Testing Data for SC-89
Package Reliability	Environmental and Package Testing Data for SSOT-23
Package Reliability	SC-70-6 (Cu)
Silicon Technology Reliability	N-Channel Accelerated Operating Life Test Result
Silicon Technology Reliability	N-Channel Accelerated Operating Life Test Result
Silicon Technology Reliability	P-Channel Accelerated Operating Life Test Result
Silicon Technology Reliability	P-Channel Accelerated Operating Life Test Result

Software Models (*.zip) [top]
Si2342DSzip	SPICE Model for Si2342DS
SiA419DJ-zip	Spice Models for SiA419DJ
SiA920DJ-zip	SPICE Models for SiA920DJ
SiB404DK-zip	SPICE Models for SiB404DK

Tape Info [top]
91-5209-x	Tape Drawing for SOT-23 (T1 and T2 Methods)
93-5213-X	SC-70 3-LEADS (T2-METHOD)
93-5217-1	Tape Drawing for SC-89 3L
Device Orientation	Device Orientation for PowerPAK SC-70
Device Orientation	Device OrientationPowerPAKŪ SC-70, PowerPAK SC-75,Thin PowerPAK SC-70, Thin PowerPAK SC-75
Device Orientation-MICRO FOOTŪ Packages	Device Orientation for MICRO FOOT 2x2, 0.5 mm Pitch, 0.25 Bump Height
Device Orientation-MICRO FOOTŪ Packages	Device Orientation for MICRO FOOT 2x3, 0.5 mm pitch, 0.250 mm Bump Height
PACK-0007-2	Device Orientation for SC70-3L, SC75A, SC89-3L, and SOT-23 (T1)
PACK-0007-8/9	Device Orientation for SC70-6L, SC89-6L, TSOP-6 (Single, Dual, Complementary or Dual Symmetrical) (T1)
PACK-0023-1	Device Orientation for MOSFETs, MICRO FOOT 2x2: 0.8-mm Pitch, 0.275-mm Bump Height (T1)
Tape Information	CARRIER TAPE FOR MicroFOOT 1 x 1 mm DIE SIZE
Tape Information	MICRO FOOTŪ 2 x 2: 0.8 mm PITCH, 0.275 mm BUMP HEIGHT (Si8401DB-T1, Si8402DB-T1, Si8405DB-T1, and Si8411DB-T1)
Tape Information	MICRO FOOTŪ 2 x 3: 0.5 mm PITCH, 0.25 mm BUMP HEIGHT
Tape Information	MICROFOOT 0.8 x 0.8 CARRIER TAPE
Tape Information	PowerPAK SC70
Tape Information	PowerPAKŪ SC-75 AND THIN PowerPAK SC-75

SPICE [top]
H-Spice Model	P-Spice Model (*.lib)	P-Spice Model (*.olb)	P-Spice Model (*.txt)	Spice Model (pdf)
Si2329DS-H Si8416DB-H Si8469DB-H Si8802DB-H SiA436DJ-H SiB914DK-H	Si2329DS-P LIB Si8416DB-P LIB Si8469DB-P LIB Si8802DB-P LIB SiA436DJ-P LIB SiB914DK-P LIB	Si2329DS-P OLB Si8416DB-P OLB Si8469DB-P OLB Si8802DB-P OLB SiA436DJ-P OLB SiB914DK-P OLB	Si2329DS-P Si8416DB-P Si8469DB-P Si8802DB-P SiA436DJ-P SiB914DK-P	Si2329DS-DS Si2342DS-DS Si8469DB-DS Si8802DB-DS SiA419DJ-DS SiA436DJ-DS SiA920DJ-DS SiB404DK-DS SiB914DK-DS SPICE Device Model Si8416DB-DS