Related Documents - 1.5 V rated on-resistance
General Information (1)
Markings (5)
Package Drawings (9)
Pad Guidelines (13)
RC Thermal Models (37)
Reel Info (1)
Reliability Data (13)
Tape Info (18)
Technical Notes (3)
SPICE (125)
|
General Information
|
|
General Information |
Useful Links |
|
Markings
|
|
PART MARKING |
MICRO FOOT Devices |
PART MARKING |
SC-70 for Si Part Numbers |
PART MARKING |
SC-75A and SC-89 Devices |
PART MARKING |
SOT-23 |
PART MARKING |
TSOP-5/6 |
|
Package Drawings
|
|
5479 |
TO-236 (SOT-23) |
5540 |
TSOP (5L & 6L) |
5550 |
SC-70 6L |
5880 |
SC-89 (SOT-563F) 6L |
5934 |
PowerPAK SC70-6L |
5935 |
PowerPAK SC75-6L |
Package Information |
Case Outline FOR PowerPAKŪ SC70T |
Package Information |
Case Outline for Thin PPAK SC75 Single |
Package Information |
SC-75A: 3-LEADS |
|
Pad Guidelines
|
|
AN807 |
Mounting LITTLE FOOT SOT-23 Power MOSFETs |
AN815 |
Single-Channel LITTLE FOOT SC-70 6-Pin MOSFET-Copper Leadframe Recommended Pad Pattern/Thermal Performance |
Application Note 826 |
RECOMMENDED MINIMUM PADS FOR SC-70: 6-Lead |
Application Note 826 |
RECOMMENDED MINIMUM PADS FOR SC-75A: 3-Lead |
Application Note 826 |
RECOMMENDED MINIMUM PADS FOR SC-89: 6-Lead |
Application Note 826 |
RECOMMENDED MINIMUM PADS FOR SoT-23 |
Application Note 826 |
RECOMMENDED pad LAYOUT FOR PowerPAKŪ Sc70-6L Dual |
Application Note 826 |
RECOMMENDED PAD LAYOUT FOR PowerPAKŪ SC70-6L Single |
Application Note 826 |
RECOMMENDED pad LAYOUT FOR PowerPAKŪ Sc75-6L Dual |
Application Note 826 |
RECOMMENDED pad LAYOUT FOR PowerPAKŪ Sc75-6L Single |
PAD Pattern |
LITTLE FOOT TSOP-6 Power MOSFETs |
PAD Pattern |
MICRO FOOT Products |
PAD Pattern |
TSOP-6 |
|
RC Thermal Models
|
|
Si1012CR_GE3_RC |
R-C Thermal Model Parameters |
Si1016CX_GE3_RC |
R-C Thermal Model Parameters |
Si1023CX-GE3_RC |
R-C Thermal Model Parameters |
Si1034CX_RC |
R-C Thermal Model Parameters |
Si1050X-RC |
RC Thermal Model for Si1050X |
Si1401EDH_RC |
R-C Thermal Model Parameters |
Si1424EDH_RC |
R-C Thermal Model Parameters |
Si1427EDH_RC |
R-C Thermal Model Parameters |
Si1489EDH_RC |
R-C Thermal Model Parameters |
Si2329DS-GE3_RC |
R-C Thermal Model Parameters |
Si2342DS_RC |
R-C Thermal Model Parameters |
Si2377EDS_RC |
R-C Thermal Model Parameters |
Si3499DV-RC |
RC Thermal Model for Si3499DV |
Si3865DDV-GE3_RC |
R-C Thermal Model Parameters |
Si8416DB_RC |
R-C Thermal Model Parameters |
Si8424DB-RC |
RC Thermal Model for Si8424DB |
Si8429DB-RC |
RC Thermal Model for Si8429DB |
Si8461DB-RC |
RC Thermal Model for Si8461DB |
Si8461DB_RC |
R-C Thermal Model Parameters |
Si8469DB_RC |
R-C Thermal Model Parameters |
Si8472DB_RC |
R-C Thermal Model Parameters |
Si8800EDB_RC |
R-C Thermal Model Parameters |
Si8802DB_RC |
R-C Thermal Model Parameters |
SiA413DJ-RC |
RC Thermal Model for SiA413DJ |
SiA419DJ-RC |
RC Thermal Model for SiA419DJ |
SiA427DJ_RC |
R-C Thermal Model Parameters |
SiA429DJ_RC |
R-C Thermal Model Parameters |
SiA431DJ_RC |
R-C Thermal Model Parameters |
SiA517DJ-RC |
RC Thermal Model for SiA517DJ |
SiA517DJ_RC |
R-C Thermal Model Parameters |
SiA533EDJ_RC |
R-C Thermal Model Parameters |
SiA920DJ_RC |
R-C Thermal Model Parameters |
SiA923EDJ_RC |
R-C Thermal Model Parameters |
SiB422EDK_RC |
R-C Thermal Model Parameters |
SiB437EDKT_RC |
R-C Thermal Model Parameters |
SiB455EDK_RC |
R-C Thermal Model Parameters |
SiB457EDK-RC |
RC Thermal Model for SiB457EDK |
SiB800EDK-RC |
RC Thermal Model for SiB800EDK |
SiB800EDK_RC |
R-C Thermal Model Parameters |
SiB914DK-RC |
RC Thermal Model for SiB914DK |
SiB914DK_RC |
R-C Thermal Model Parameters |
SiS902DN-RC |
RC Thermal Model for SiS902DN |
SiS902DN_RC |
R-C Thermal Model Parameters |
|
Reel Info
|
|
Reel Information |
Lok Reel |
|
Reliability Data
|
|
Package Reliability |
Environmental and Package Testing Data for MICRO FOOTŪ |
Package Reliability |
Environmental and Package Testing Data for PowerPAKŪ SC-70 |
Package Reliability |
Environmental and Package Testing Data for PowerPAKŪ SC-75 |
Package Reliability |
Environmental and Package Testing Data for SC-75A |
Package Reliability |
Environmental and Package Testing Data for SC-89 |
Package Reliability |
Environmental and Package Testing Data for SSOT-23 |
Package Reliability |
Environmental and Package Testing Data for TSOP-6 |
Package Reliability |
SC-70-6 (Cu) |
Silicon Technology Reliability |
N-Channel Accelerated Operating Life Test Result |
Silicon Technology Reliability |
N-Channel Accelerated Operating Life Test Result |
Silicon Technology Reliability |
P-Channel Accelerated Operating Life Test Result |
Silicon Technology Reliability |
P-Channel Accelerated Operating Life Test Result |
Silicon Technology Reliability |
P-Channel Accelerated Operating Life Test Result |
|
Tape Info
|
|
90-2377-1 |
Tape Drawing for SC-89 6L (TO-563) Flat |
91-5209-x |
Tape Drawing for SOT-23 (T1 and T2 Methods) |
93-2345-X |
TSOP: 5/6-Lead (SC-59) |
93-5213-X |
SC-70 3-LEADS (T2-METHOD) |
93-5217-1 |
Tape Drawing for SC-75A 3L |
Device Orientation |
Device Orientation for PowerPAK SC-70 |
Device Orientation-MICRO FOOTŪ Packages |
Device Orientation for MICRO FOOT 2x2, 0.5 mm Pitch, 0.25 Bump Height |
Device Orientation-MICRO FOOTŪ Packages |
Device Orientation for MICRO FOOT 2x3, 0.5 mm pitch, 0.250 mm Bump Height |
PACK-0007-2 |
Device Orientation for SC70-3L, SC75A, SC89-3L, and SOT-23 (T1) |
PACK-0007-21 |
Device Orientation PowerPAKŪ SC-70, PowerPAK SC-75,Thin PowerPAK SC-70, Thin PowerPAK SC-75 |
PACK-0007-8/9 |
Device Orientation for SC70-6L, SC89-6L, TSOP-6 (Single, Dual, Complementary or Dual Symmetrical) (T1) |
PACK-0023-1 |
Device Orientation for MOSFETs, MICRO FOOT 2x2: 0.8-mm Pitch, 0.275-mm Bump Height (T1) |
PACK-0023-10 |
Device Orientation for MICRO FOOT 2x3, 0.5 mm pitch, 0.250 mm bump height (T2) |
PACK-0023-11 |
Device Orientation for MICRO FOOT 2x2, 0.5 mm pitch, 0.250 mm bump height (T2) |
Tape Information |
CARRIER TAPE FOR MicroFOOT 1 x 1 mm DIE SIZE |
Tape Information |
MICRO FOOTŪ 2 x 2: 0.8 mm PITCH, 0.275 mm BUMP HEIGHT (Si8401DB-T1, Si8402DB-T1, Si8405DB-T1, and Si8411DB-T1) |
Tape Information |
MICRO FOOTŪ 2 x 3: 0.5 mm PITCH, 0.25 mm BUMP HEIGHT |
Tape Information |
MICROFOOT 0.8 x 0.8 CARRIER TAPE |
Tape Information |
PowerPAK SC70 |
Tape Information |
PowerPAKŪ SC-75 AND THIN PowerPAK SC-75 |
|
Technical Notes
|
|
Specification Comparison |
Si1012CR vs. Si1012R |
Specification Comparison |
Si1016CX vs. Si1016X |
Specification Comparison |
Si1034CX vs. Si1034X |
Useful Links
- Service and Support
- Product Information
- Featured Products



General Information
Si1012CR-H

