Related Documents - 1.5 V rated on-resistance
General Information (1)
Markings (6)
Package Drawings (10)
Pad Guidelines (14)
RC Thermal Models (36)
Reel Info (1)
Reliability Data (13)
Software Models (*.zip) (14)
Tape Info (19)
Tech Tip (4)
SPICE (94)
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General Information
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General Information |
Useful Links |
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Markings
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PART MARKING |
SC-70 for Si Part Numbers |
PART MARKING |
SC-75A and SC-89 Devices |
PART MARKING |
SOT-23 |
PART MARKING |
TSOP-5/6 |
Part Marking Information |
MICRO FOOTŪ |
Part Marking Information |
MICRO FOOTŪ 0.8 x 0.8 Devices |
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Package Drawings
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5479 |
TO-236 (SOT-23) |
5540 |
TSOP (5L & 6L) |
5550 |
SC-70 6L |
5869 |
SC-89 3L |
5880 |
SC-89 (SOT-563F) 6L |
5934 |
PowerPAK SC70-6L |
5935 |
PowerPAK SC75-6L |
Package Information |
Case Outline FOR PowerPAKŪ SC70T |
Package Information |
Case Outline for Thin PPAK SC75 Single |
Package Information |
SC-75A: 3-LEADS |
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Pad Guidelines
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AN807 |
Mounting LITTLE FOOT SOT-23 Power MOSFETs |
AN815 |
Single-Channel LITTLE FOOT SC-70 6-Pin MOSFET-Copper Leadframe Recommended Pad Pattern/Thermal Performance |
Application Note 826 |
RECOMMENDED MINIMUM PADS FOR SC-70: 6-Lead |
Application Note 826 |
RECOMMENDED MINIMUM PADS FOR SC-75A: 3-Lead |
Application Note 826 |
RECOMMENDED MINIMUM PADS FOR SC-89: 3-Lead |
Application Note 826 |
RECOMMENDED MINIMUM PADS FOR SC-89: 6-Lead |
Application Note 826 |
RECOMMENDED MINIMUM PADS FOR SoT-23 |
Application Note 826 |
RECOMMENDED pad LAYOUT FOR PowerPAKŪ Sc70-6L Dual |
Application Note 826 |
RECOMMENDED PAD LAYOUT FOR PowerPAKŪ SC70-6L Single |
Application Note 826 |
RECOMMENDED pad LAYOUT FOR PowerPAKŪ Sc75-6L Dual |
Application Note 826 |
RECOMMENDED pad LAYOUT FOR PowerPAKŪ Sc75-6L Single |
PAD Pattern |
LITTLE FOOT TSOP-6 Power MOSFETs |
PAD Pattern |
MICRO FOOT Products |
PAD Pattern |
TSOP-6 |
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RC Thermal Models
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Si1012CR_GE3_RC |
R-C Thermal Model Parameters |
Si1016CX_GE3_RC |
R-C Thermal Model Parameters |
Si1023CX-GE3_RC |
R-C Thermal Model Parameters |
Si1034CX_RC |
R-C Thermal Model Parameters |
si1050x-rc |
RC Thermal Model for Si1050X |
Si1401EDH_RC |
R-C Thermal Model Parameters |
Si1424EDH_RC |
R-C Thermal Model Parameters |
Si1427EDH_RC |
R-C Thermal Model Parameters |
Si1489EDH_RC |
R-C Thermal Model Parameters |
Si2329DS-GE3_RC |
R-C Thermal Model Parameters |
Si2342DS_RC |
R-C Thermal Model Parameters |
Si2377EDS_RC |
R-C Thermal Model Parameters |
si3499dv-rc |
RC Thermal Model for Si3499DV |
Si3865DDV-GE3_RC |
R-C Thermal Model Parameters |
Si8416DB_RC |
R-C Thermal Model Parameters |
Si8461DB_RC |
R-C Thermal Model Parameters |
Si8469DB_RC |
R-C Thermal Model Parameters |
Si8472DB_RC |
R-C Thermal Model Parameters |
Si8800EDB_RC |
R-C Thermal Model Parameters |
Si8802DB_RC |
R-C Thermal Model Parameters |
Si8805EDB_RC |
R-C Thermal Model Parameters |
SiA413ADJ_RC |
R-C Thermal Model Parameters |
sia419dj-rc |
RC Thermal Model for SiA419DJ |
SiA427ADJ_RC |
R-C Thermal Model Parameters |
SiA429DJ_RC |
R-C Thermal Model Parameters |
SiA431DJ_RC |
R-C Thermal Model Parameters |
SiA448DJ_RC |
R-C Thermal Model Parameters |
SiA517DJ_RC |
R-C Thermal Model Parameters |
SiA533EDJ_RC |
R-C Thermal Model Parameters |
SiA920DJ_RC |
R-C Thermal Model Parameters |
SiA923EDJ_RC |
R-C Thermal Model Parameters |
SiB422EDK_RC |
R-C Thermal Model Parameters |
SiB437EDKT_RC |
R-C Thermal Model Parameters |
SiB455EDK_RC |
R-C Thermal Model Parameters |
SiB914DK_RC |
R-C Thermal Model Parameters |
SiS902DN_RC |
R-C Thermal Model Parameters |
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Reel Info
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Reel Information |
Lok Reel |
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Reliability Data
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Package Reliability |
Environmental and Package Testing Data for MICRO FOOTŪ |
Package Reliability |
Environmental and Package Testing Data for PowerPAKŪ SC-70 |
Package Reliability |
Environmental and Package Testing Data for PowerPAKŪ SC-75 |
Package Reliability |
Environmental and Package Testing Data for SC-75A |
Package Reliability |
Environmental and Package Testing Data for SC-89 |
Package Reliability |
Environmental and Package Testing Data for SSOT-23 |
Package Reliability |
Environmental and Package Testing Data for TSOP-6 |
Package Reliability |
SC-70-6 (Cu) |
Silicon Technology Reliability |
N-Channel Accelerated Operating Life Test Result |
Silicon Technology Reliability |
N-Channel Accelerated Operating Life Test Result |
Silicon Technology Reliability |
P-Channel Accelerated Operating Life Test Result |
Silicon Technology Reliability |
P-Channel Accelerated Operating Life Test Result |
Silicon Technology Reliability |
P-Channel Accelerated Operating Life Test Result |
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Software Models (*.zip)
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Si2342DSzip |
SPICE Model for Si2342DS |
Si2377EDS-zip |
SPICE Models for Si2377EDS |
Si3499DV-zip |
SPICE Models for Si3499DV |
Si8800EDB-zip |
SPICE Models for Si8800EDB |
Si8808DB-zip |
SPICE Models for Si8808DB |
Si8817DB-zip |
SPICE Models for Si8817DB |
SiA419DJ-zip |
Spice Models for SiA419DJ |
SiA429DJT-zip |
SPICE Models for SiA429DJT |
SiA447DJ-zip |
SPICE Models for SiA447DJ |
SiA448DJ-zip |
SPICE Models for SiA448DJ |
SiA920DJ-zip |
SPICE Models for SiA920DJ |
SiB422EDK-zip |
SPICE Models for SiB422EDK |
SiB455EDK-zip |
SPICE Models for SiB455EDK |
SiB457EDK-zip |
SPICE Models for SiB457EDK |
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Tape Info
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90-2377-1 |
Tape Drawing for SC-89 6L (TO-563) Flat |
91-5209-x |
Tape Drawing for SOT-23 (T1 and T2 Methods) |
93-2345-X |
TSOP: 5/6-Lead (SC-59) |
93-5213-X |
SC-70 3-LEADS (T2-METHOD) |
93-5217-1 |
Tape Drawing for SC-75A 3L |
93-5217-1 |
Tape Drawing for SC-89 3L |
Device Orientation |
Device Orientation for PowerPAK SC-70 |
Device Orientation |
Device OrientationPowerPAKŪ SC-70, PowerPAK SC-75,Thin PowerPAK SC-70, Thin PowerPAK SC-75 |
Device Orientation-MICRO FOOTŪ Packages |
Device Orientation for MICRO FOOT 2x2, 0.5 mm Pitch, 0.25 Bump Height |
Device Orientation-MICRO FOOTŪ Packages |
Device Orientation for MICRO FOOT 2x3, 0.5 mm pitch, 0.250 mm Bump Height |
PACK-0007-2 |
Device Orientation for SC70-3L, SC75A, SC89-3L, and SOT-23 (T1) |
PACK-0007-8/9 |
Device Orientation for SC70-6L, SC89-6L, TSOP-6 (Single, Dual, Complementary or Dual Symmetrical) (T1) |
PACK-0023-1 |
Device Orientation for MOSFETs, MICRO FOOT 2x2: 0.8-mm Pitch, 0.275-mm Bump Height (T1) |
Tape Information |
CARRIER TAPE FOR MicroFOOT 1 x 1 mm DIE SIZE |
Tape Information |
MICRO FOOTŪ 2 x 2: 0.8 mm PITCH, 0.275 mm BUMP HEIGHT (Si8401DB-T1, Si8402DB-T1, Si8405DB-T1, and Si8411DB-T1) |
Tape Information |
MICRO FOOTŪ 2 x 3: 0.5 mm PITCH, 0.25 mm BUMP HEIGHT |
Tape Information |
MICROFOOT 0.8 x 0.8 CARRIER TAPE |
Tape Information |
PowerPAK SC70 |
Tape Information |
PowerPAKŪ SC-75 AND THIN PowerPAK SC-75 |
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Tech Tip
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Specification Comparison |
Si1012CR vs. Si1012R |
Specification Comparison |
Si1016CX vs. Si1016X |
Specification Comparison |
Si1034CX vs. Si1034X |
Specification Comparison |
Si2333DDS vs. Si2333CDS |
Useful Links
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General Information
Si1012CR-H


