Related Documents - P-channel
Application Notes (3)
Markings (8)
Package Drawings (10)
Pad Guidelines (14)
RC Thermal Models (67)
Reel Info (1)
Reliability Data (16)
Software Models (*.zip) (33)
Tape Info (18)
SPICE (59)
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Application Notes
|
|
 AN827 |
Torque Recommendations for TO-220 Devices |
| Application Note 914 |
"PowerPAK 1212-8", The Proven Automotive Package |
| Application Note AN917 |
Dual-Channel LITTLE FOOT 6-Pin SC-70 MOSFET Copper Leadframe Version Recommended Pad Pattern and Thermal Performance 175 °C Rated Part |
|
Markings
|
|
| PART MARKING |
SC-70 for Si Part Numbers |
| PART MARKING |
SC-75A and SC-89 Devices |
| PART MARKING |
SO-8 |
| PART MARKING |
SOT-23 |
| PART MARKING |
TSOP-5/6 |
| Part Marking Information |
devices: TO-220, TO-262, TO-263 (D2PAK, D2PAK-5) |
| Part Marking Information |
PowerPAKŪ SO-8, PowerPAK SO-8L, PowerPAK 1212-8, PowerPAIRŪ 6 x 3.7, PowerPAK 1212-8S, PowerPAIR 6 x 5, PowerPAIR 3 x 3 |
| Part Marking Information |
TO-252 (DPAK), TO251 |
|
Package Drawings
|
|
| 5479 |
TO-236 (SOT-23) |
| 5498 |
SOIC-8 (Narrow) |
| 5540 |
TSOP (5L & 6L) |
| 5550 |
SC-70 6L |
| 5880 |
SC-89 (SOT-563F) 6L |
| Package Information |
PowerPAKŪ 1212, (Single/Dual) |
| Package Information |
PowerPAKŪ SO-8L |
| Package Information |
TO-220AB |
| Package Information |
TO-252AA Case Outline |
| Package Information |
TO-263 (D2PAK): 3-LEAD |
|
Pad Guidelines
|
|
| AN807 |
Mounting LITTLE FOOT SOT-23 Power MOSFETs |
| AN822 |
PowerPAK 1212 Mounting and Thermal Considerations |
| Application Note 826 |
RECOMMENDED MINIMUM PADS FOR DPAK (TO-252) |
| Application Note 826 |
RECOMMENDED MINIMUM PADS FOR PowerPAKŪ 1212-8 Single |
| Application Note 826 |
RECOMMENDED MINIMUM PADS FOR SC-70: 6-Lead |
| Application Note 826 |
RECOMMENDED MINIMUM PADS FOR SC-89: 6-Lead |
| Application Note 826 |
RECOMMENDED MINIMUM PADS FOR SoT-23 |
| PAD Pattern |
D2PAK |
| PAD Pattern |
LITTLE FOOT SO-8 Power MOSFETs |
| PAD Pattern |
LITTLE FOOT TSOP-6 Power MOSFETs |
| PAD Pattern |
PowerPAKŪ SO-8L Dual |
| PAD Pattern |
PowerPAKŪ SO-8L Single |
| PAD Pattern |
SO-8 |
| PAD Pattern |
TSOP-6 |
|
RC Thermal Models
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|
| Si4101DY-GE3_RC |
R-C Thermal Model Parameters |
| Si4532EY_RC |
R-C Thermal Model Parameters |
| Si5442DU_RC |
R-C Thermal Model Parameters |
| Si7101DN_RC |
R-C Thermal Model Parameters |
| SiA439EDJ_RC |
R-C Thermal Model Parameters |
| SiA467DJ_RC |
R-C Thermal Model Parameters |
| SiA922EDJ_RC |
R-C Thermal Model Parameters |
| SiRA34DP_RC |
R-C Thermal Model Parameters |
| SQ1025X_RC |
R-C Thermal Model Parameters |
| SQ1025X_RC |
R-C Thermal Model Parameters |
| SQ1421EEH_RC |
R-C Thermal Model Parameters |
| SQ1431EH_RC |
R-C Thermal Model Parameters |
| SQ2301ES_RC |
R-C Thermal Model Parameters |
| SQ2303ES_RC |
R-C Thermal Model Parameters |
| SQ2309ES_RC |
R-C Thermal Model Parameters |
| SQ2315ES_RC |
R-C Thermal Model Parameters |
| SQ2319ES_RC |
R-C Thermal Model Parameters |
| SQ2325ES_RC |
R-C Thermal Model Parameters |
| SQ2337ES_RC |
R-C Thermal Model Parameters |
| SQ2351ES_RC |
R-C Thermal Model Parameters |
| SQ2361EES_RC |
R-C Thermal Model Parameters |
| SQ3419EEV_RC |
R-C Thermal Model Parameters |
| SQ3427EEV_RC |
R-C Thermal Model Parameters |
| SQ3457EV_RC |
R-C Thermal Model Parameters |
| SQ3469EV_RC |
R-C Thermal Model Parameters |
| SQ3481EV_RC |
R-C Thermal Model Parameters |
| SQ4401EY_RC |
R-C Thermal Model Parameters |
| SQ4425EY_RC |
R-C Thermal Model Parameters |
| SQ4431EY_RC |
R-C Thermal Model Parameters |
| SQ4435EY_RC |
R-C Thermal Model Parameters |
| SQ4483EEY_RC |
R-C Thermal Model Parameters |
| SQ4937EY_RC |
R-C Thermal Model Parameters |
| SQ4949EY_RC |
R-C Thermal Model Parameters |
| SQ4953EY_RC |
R-C Thermal Model Parameters |
| SQ4961EY_RC |
R-C Thermal Model Parameters |
| SQ7415AEN_RC |
R-C Thermal Model Parameters |
| SQ9407EY_RC |
R-C Thermal Model Parameters |
| SQD19P06-60L_RC |
R-C Thermal Model Parameters |
| SQD40P10-40L_RC |
R-C Thermal Model Parameters |
| SQD45P03-12_RC |
R-C Thermal Model Parameters |
| SQD50P03-07_RC |
R-C Thermal Model Parameters |
| SQD50P04-13L_RC |
R-C Thermal Model Parameters |
| SQD50P06-15L_RC |
R-C Thermal Model Parameters |
| SQD50P08-25L_RC |
R-C Thermal Model Parameters |
| SQD50P08-27_RC |
R-C Thermal Model Parameters |
| SQD90P04-9m4L_RC |
R-C Thermal Model Parameters |
| SQJ401EP_RC |
R-C Thermal Model Parameters |
| SQJ431EP_RC |
R-C Thermal Model Parameters |
| SQJ461EP_RC |
R-C Thermal Model Parameters |
| SQJ463EP_RC |
R-C Thermal Model Parameters |
| SQJ465EP_RC |
R-C Thermal Model Parameters |
| SQJ469EP_RC |
R-C Thermal Model Parameters |
| SQJ500EP_RC |
R-C Thermal Model Parameters |
| SQJ941EP_RC |
R-C Thermal Model Parameters |
| SQJ951EP_RC |
R-C Thermal Model Parameters |
| SQJ963EP_RC |
R-C Thermal Model Parameters |
| SQM110P06-8m9L_RC |
R-C Thermal Model Parameters |
| SQM120P04-04L_RC |
R-C Thermal Model Parameters |
| SQM120P06-07L_RC |
R-C Thermal Model Parameters |
| SQM40P10-40L_RC |
R-C Thermal Model Parameters |
| SQM50P03-07_RC |
R-C Thermal Model Parameters |
| SQM50P04-09L_RC |
R-C Thermal Model Parameters |
| SQM50P06-15L_RC |
R-C Thermal Model Parameters |
| SQM50P08-25L_RC |
R-C Thermal Model Parameters |
| SQS401EN_RC |
R-C Thermal Model Parameters |
| SQS405EN_RC |
R-C Thermal Model Parameters |
| SQS423EN_RC |
R-C Thermal Model Parameters |
|
Reel Info
|
|
| Reel Information |
Lok Reel |
|
Reliability Data
|
|
| Package Reliability |
Environmental and Package Testing Data for D2PAK (TO-263), TO-220 |
| Package Reliability |
Environmental and Package Testing Data for DPAK (TO-252) |
| Package Reliability |
Environmental and Package Testing Data for PowerPAKŪ 1212-8 |
| Package Reliability |
Environmental and Package Testing Data for PowerPAKŪ 1212-8 |
| Package Reliability |
Environmental and Package Testing Data for PowerPAKŪ SO-8L |
| Package Reliability |
Environmental and Package Testing Data for SC-70 |
| Package Reliability |
Environmental and Package Testing Data for SO-8 |
| Package Reliability |
Environmental and Package Testing Data for SO-8 |
| Package Reliability |
Environmental and Package Testing Data for SSOT-23 |
| Package Reliability |
Environmental and Package Testing Data for SSOT-23 |
| Package Reliability |
Environmental and Package Testing Data for TSOP-6 |
| Package Reliability |
SC-70-6 (Cu) |
| Silicon Technology Reliability |
N-Channel - Automotive Accelerated Operating Life Test Result |
| Silicon Technology Reliability |
P-Channel - Automotive Accelerated Operating Life Test Result |
| Silicon Technology Reliability |
P-Channel Accelerated Operating Life Test Result |
| Silicon Technology Reliability |
P-Channel Accelerated Operating Life Test Result |
|
Software Models (*.zip)
|
|
| SQ1431EH-zip |
SPICE Models for SQ1431EH |
| SQ2303ES-zip |
SPICE Models for SQ2303ES |
| SQ2309ES-zip |
SPICE Models for SQ2309ES |
| SQ2319ES-zip |
SPICE Models for SQ2319ES |
| SQ3419EEV-zip |
SPICE Models for SQ3419EEV |
| SQ3457EV-zip |
SPICE Models for SQ3457EV |
| SQ3481EV-zip |
SPICE Models for SQ3481EV |
| SQ4425EY-zip |
SPICE Model for SQ4425EY |
| SQ4431EY-zip |
SPICE Models for SQ4431EY |
| SQ4532EY-zip |
SPICE Models for SQ4532EY |
| SQ4937EY-zip |
SPICE Models for SQ4937EY |
| SQ4949EY-zip |
SPICE Models for SQ4949EY |
| SQ4953EY-zip |
SPICE Model for SQ4953EY |
| SQ7415AEN-zip |
Spice Models for SQ7415AEN |
| SQ9407EY-zip |
SPICE Models for SQ9407EY |
| SQD19P06-60L-zip |
SPICE Models for SQD19P06-60L |
| SQD40P10-40L-zip |
Spice Models for SQD40P10-40L |
| SQD50P03-07-zip |
SPICE Models for SQD50P03-07 |
| SQD50P04-13L-zip |
SPICE Models for SQD50P04-13L |
| SQD50P06-15L-zip |
SPICE Models for SQD50P06-15L |
| SQD50P08-25L-zip |
SPICE Models for SQD50P08-25L |
| SQJ401EP-zip |
SPICE Models for SQJ401EP |
| SQJ463EP-zip |
Spice Models for SQJ463EP |
| SQJ469EP-zip |
Spice Models for SQJ469EP |
| SQJ963EP-zip |
SPICE Models for SQJ963EP |
| SQM120P04-04L-zip |
SPICE Models for SQM120P04-04L |
| SQM120P06-07L-zip |
SPICE Models for SQM120P06-07L |
| SQM40P10-40L-zip |
SPICE Models for SQM40P10-40L |
| SQM50P04-09L-zip |
SPICE Models for SQM50P04-09L |
| SQM50P06-15L-zip |
SPICE Models for SQM50P06-15L |
| SQM50P08-25L-zip |
Spice Models for SQM50P08-25L |
| SQS401EN-zip |
SPICE Models for SQS401EN |
| SQS423EN-zip |
SPICE Models for SQS423EN |
|
Tape Info
|
|
| 90-2339-1 |
Tape Drawing for TO-252 (DPAK) (T1 Method) |
| 90-2342-x |
TO-263 (D2PAK): 3- and 5-lead |
| 90-2369-x |
Tape Drawing for TO-252 (DPAK) (T4 Method) |
| 90-2377-1 |
Tape Drawing for SC-89 6L (TO-563) Flat |
| 91-5209-x |
Tape Drawing for SOIC PACKAGES (NARROW AND WIDE BODY) |
| 91-5209-x |
Tape Drawing for SOT-23 (T1 and T2 Methods) |
| 93-2345-X |
TSOP: 5/6-Lead (SC-59) |
| 93-5213-X |
SC-70 3-LEADS (T2-METHOD) |
| Device Orientation |
Device Orientation for PowerPAK 1212-8, PowerPAK 1212-8S, and PowerPAK SO-1 |
| Device Orientation |
Device Orientation for PowerPAK SO-8L |
| PACK-0007-2 |
Device Orientation for SC70-3L, SC75A, SC89-3L, and SOT-23 (T1) |
| PACK-0007-6 |
Device Orientation for MSOP, SOIC, SSOP, and TSSOP (T1) |
| PACK-0007-8/9 |
Device Orientation for SC70-6L, SC89-6L, TSOP-6 (Single, Dual, Complementary or Dual Symmetrical) (T1) |
| PACK-0020- |
Device Orientation for TO-252 and Reverse TO-252 (T4) |
| PACK-0020- |
Device Orientation for TO-252, Reverse TO-252 and TO-251 Short Lead (T1) |
| PACK-0020- |
Device Orientation for TO-263 (T1) |
| Tape Information |
PowerPAK SO-8L Carrier Tape |
| Tape Information |
PowerPAKŪ 1212 |
SQ2301ES-H
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