Related Documents - Drain-to-source voltage 21 V to 30 V

  Application Notes (1)
  Markings (7)
  Package Drawings (9)
  Pad Guidelines (13)
  RC Thermal Models (21)
  Reel Info (1)
  Reliability Data (11)
  Software Models (*.zip) (12)
  Tape Info (17)
  SPICE (14)

Application Notes [top]
AN827	Torque Recommendations for TO-220 Devices

Markings [top]
PART MARKING	SC-70 for Si Part Numbers
PART MARKING	SO-8
PART MARKING	SOT-23
PART MARKING	TSOP-5/6
Part Marking Information	devices: TO-220, TO-262, TO-263 (D2PAK, D2PAK-5)
Part Marking Information	PowerPAK® SO-8, PowerPAK SO-8L, PowerPAK 1212-8, PowerPAIR® 6 x 3.7, PowerPAK 1212-8S, PowerPAIR 6 x 5, PowerPAIR 3 x 3
Part Marking Information	TO-252 (DPAK), TO251

Package Drawings [top]
5479	TO-236 (SOT-23)
5498	SOIC-8 (Narrow)
5540	TSOP (5L & 6L)
5550	SC-70 6L
Package Information	PowerPAK® 1212, (Single/Dual)
Package Information	PowerPAK® SO-8L
Package Information	TO-220AB
Package Information	TO-252AA Case Outline
Package Information	TO-263 (D2PAK): 3-LEAD

Pad Guidelines [top]
AN807	Mounting LITTLE FOOT SOT-23 Power MOSFETs
AN822	PowerPAK 1212 Mounting and Thermal Considerations
Application Note 826	RECOMMENDED MINIMUM PADS FOR DPAK (TO-252)
Application Note 826	RECOMMENDED MINIMUM PADS FOR PowerPAK® 1212-8 Single
Application Note 826	RECOMMENDED MINIMUM PADS FOR SC-70: 6-Lead
Application Note 826	RECOMMENDED MINIMUM PADS FOR SoT-23
PAD Pattern	D2PAK
PAD Pattern	LITTLE FOOT SO-8 Power MOSFETs
PAD Pattern	LITTLE FOOT TSOP-6 Power MOSFETs
PAD Pattern	PowerPAK® SO-8L Dual
PAD Pattern	PowerPAK® SO-8L Single
PAD Pattern	SO-8
PAD Pattern	TSOP-6

RC Thermal Models [top]
Si4532EY_RC	R-C Thermal Model Parameters
SiA439EDJ_RC	R-C Thermal Model Parameters
SiA467DJ_RC	R-C Thermal Model Parameters
SiA922EDJ_RC	R-C Thermal Model Parameters
SQ1431EH_RC	R-C Thermal Model Parameters
SQ2303ES_RC	R-C Thermal Model Parameters
SQ3457EV_RC	R-C Thermal Model Parameters
SQ3481EV_RC	R-C Thermal Model Parameters
SQ4425EY_RC	R-C Thermal Model Parameters
SQ4431EY_RC	R-C Thermal Model Parameters
SQ4435EY_RC	R-C Thermal Model Parameters
SQ4483EEY_RC	R-C Thermal Model Parameters
SQ4937EY_RC	R-C Thermal Model Parameters
SQ4949EY_RC	R-C Thermal Model Parameters
SQ4953EY_RC	R-C Thermal Model Parameters
SQD45P03-12_RC	R-C Thermal Model Parameters
SQD50P03-07_RC	R-C Thermal Model Parameters
SQJ941EP_RC	R-C Thermal Model Parameters
SQJ951EP_RC	R-C Thermal Model Parameters
SQM50P03-07_RC	R-C Thermal Model Parameters
SQS423EN_RC	R-C Thermal Model Parameters

Reel Info [top]
Reel Information	Lok Reel

Reliability Data [top]
Package Reliability	Environmental and Package Testing Data for D2PAK (TO-263), TO-220
Package Reliability	Environmental and Package Testing Data for DPAK (TO-252)
Package Reliability	Environmental and Package Testing Data for PowerPAK® 1212-8
Package Reliability	Environmental and Package Testing Data for PowerPAK® SO-8L
Package Reliability	Environmental and Package Testing Data for SO-8
Package Reliability	Environmental and Package Testing Data for SO-8
Package Reliability	Environmental and Package Testing Data for SSOT-23
Package Reliability	Environmental and Package Testing Data for TSOP-6
Package Reliability	SC-70-6 (Cu)
Silicon Technology Reliability	P-Channel - Automotive Accelerated Operating Life Test Result
Silicon Technology Reliability	P-Channel Accelerated Operating Life Test Result

Software Models (*.zip) [top]
SQ1431EH-zip	SPICE Models for SQ1431EH
SQ2303ES-zip	SPICE Models for SQ2303ES
SQ3457EV-zip	SPICE Models for SQ3457EV
SQ3481EV-zip	SPICE Models for SQ3481EV
SQ4425EY-zip	SPICE Model for SQ4425EY
SQ4431EY-zip	SPICE Models for SQ4431EY
SQ4532EY-zip	SPICE Models for SQ4532EY
SQ4937EY-zip	SPICE Models for SQ4937EY
SQ4949EY-zip	SPICE Models for SQ4949EY
SQ4953EY-zip	SPICE Model for SQ4953EY
SQD50P03-07-zip	SPICE Models for SQD50P03-07
SQS423EN-zip	SPICE Models for SQS423EN

Tape Info [top]
90-2339-1	Tape Drawing for TO-252 (DPAK) (T1 Method)
90-2342-x	TO-263 (D2PAK): 3- and 5-lead
90-2369-x	Tape Drawing for TO-252 (DPAK) (T4 Method)
91-5209-x	Tape Drawing for SOIC PACKAGES (NARROW AND WIDE BODY)
91-5209-x	Tape Drawing for SOT-23 (T1 and T2 Methods)
93-2345-X	TSOP: 5/6-Lead (SC-59)
93-5213-X	SC-70 3-LEADS (T2-METHOD)
Device Orientation	Device Orientation for PowerPAK 1212-8, PowerPAK 1212-8S, and PowerPAK SO-1
Device Orientation	Device Orientation for PowerPAK SO-8L
PACK-0007-2	Device Orientation for SC70-3L, SC75A, SC89-3L, and SOT-23 (T1)
PACK-0007-6	Device Orientation for MSOP, SOIC, SSOP, and TSSOP (T1)
PACK-0007-8/9	Device Orientation for SC70-6L, SC89-6L, TSOP-6 (Single, Dual, Complementary or Dual Symmetrical) (T1)
PACK-0020-	Device Orientation for TO-252 and Reverse TO-252 (T4)
PACK-0020-	Device Orientation for TO-252, Reverse TO-252 and TO-251 Short Lead (T1)
PACK-0020-	Device Orientation for TO-263 (T1)
Tape Information	PowerPAK SO-8L Carrier Tape
Tape Information	PowerPAK® 1212

SPICE [top]
H-Spice Model	Spice Model (pdf)
SQJ941EP-H	SQ1431EH-DS SQ2303ES-DS SQ3457EV-DS SQ3481EV-DS SQ4425EY-DS SQ4431EY-DS SQ4532EY-DS SQ4937EY-DS SQ4949EY-DS SQ4953EY-DS SQD50P03-07-DS SQJ941EP-DS SQS423EN-DS