Markings (1)
  Pad Guidlines (2)
  Package Drawing (1)
  Reliability Data (3)
  Reel Info (1)
  RC Thermal Models (4)
  Tape Info (2)
  SPICE (20)

Markings
PART MARKING	1206-8 ChipFET and PowerPAK ChipFET

Pad Guidlines
AN826 - PowerPAK ChipFET Dual	Recommended Minimum PAD Pattern
Application Note 826	RECOMMENDED minimum pads FOR PowerPAK? ChipFET? Dual

Package Drawing
5940	PowerPAK ChipFET Dual Pad

Reliability Data
Package Reliability	Environmental and Package Testing Data For PowerPAK ChipFET
Silicon Technology Reliability	P-Channel Accelerated Operating Life Test Result
Silicon Technology Reliability	N-Channel Accelerated Operating Life Test Result

Reel Info
Reel Information	LOK REEL

RC Thermal Models
Si5938DU-RC	RC Thermal Model for Si5938DU
Si5943DU-RC	RC Thermal Model for Si5943DU
Si5944DU-RC	RC Thermal Model for Si5944DU
Si5947DU-RC	RC Thermal Model for Si5947DU

Tape Info
93_5248_x	Tape Drawing for PowerPAK ChipFET
PACK-0007-13	Device Orientation for 1206-8 ChipFET (T1)

SPICE
H-SPICE	P-SPICE	P-SPICE (*.olb)	P-SPICE (*.lib)	SPICE PDF
Si5938DU-H  Si5943DU-H  Si5944DU-H  Si5947DU-H	Si5938DU-P  Si5943DU-P  Si5944DU-P  Si5947DU-P	Si5938DU-P OLB  Si5943DU-P OLB  Si5944DU-P OLB  Si5947DU-P OLB	Si5938DU-P LIB  Si5943DU-P LIB  Si5944DU-P LIB  Si5947DU-P LIB	Si5938DU-DS  Si5943DU-DS  Si5944DU-DS  Si5947DU-DS