Pad Guidelines [top]
AN811	Single-Channel 1206-8 ChipFET Power MOSFET Recommended Pad Pattern/Thermal Performance
AN815	Single-Channel LITTLE FOOT SC-70 6-Pin MOSFET-Copper Leadframe Recommended Pad Pattern/Thermal Performance
AN821	PowerPAK SO-8 Mounting and Thermal Considerations
AN822	PowerPAK 1212 Mounting and Thermal Considerations
Application Note 826	RECOMMENDED MINIMUM PADS FOR 1206-8 ChipFET®
Application Note 826	RECOMMENDED MINIMUM PADS FOR PowerPAK® 1212-8 Single
Application Note 826	RECOMMENDED minimum pads FOR PowerPAK® ChipFET® Single
Application Note 826	RECOMMENDED MINIMUM PADS FOR PowerPAK® SO-8 Dual
Application Note 826	RECOMMENDED MINIMUM PADS FOR PowerPAK® SO-8 Single
Application Note 826	RECOMMENDED MINIMUM PADS FOR SC-70: 6-Lead
Application Note 826	RECOMMENDED pad LAYOUT FOR PowerPAK® Sc70-6L Dual
Application Note 826	RECOMMENDED PAD LAYOUT FOR PowerPAK® SC70-6L Single
Application Note 826	RECOMMENDED pad LAYOUT FOR PowerPAK® Sc75-6L Single
PAD Pattern	LITTLE FOOT SO-8 Power MOSFETs
PAD Pattern	LITTLE FOOT TSOP-6 Power MOSFETs
PAD Pattern	MICRO FOOT Products
PAD Pattern	SO-8
PAD Pattern	TSOP-6

Tape Info [top]
91-5209-x	Tape Drawing for SOIC PACKAGES (NARROW AND WIDE BODY)
93-2345-X	TSOP: 5/6-Lead (SC-59)
93-5213-X	SC-70 3-LEADS (T2-METHOD)
Device Orientation	Device Orientation for PowerPAK SC-70
Device Orientation-MICRO FOOT® Packages	Device Orientation for MICRO FOOT 2x3, 0.5 mm pitch, 0.250 mm Bump Height
PACK-0007-13	Device Orientation for 1206-8 ChipFET (T1)
PACK-0007-14	Device Orientation for PowerPAK 1212-8 and PowerPAK SO-8 (T1)
PACK-0007-21	Device Orientation PowerPAK® SC-70, PowerPAK SC-75,Thin PowerPAK SC-70, Thin PowerPAK SC-75
PACK-0007-6	Device Orientation for MSOP, SOIC, SSOP, and TSSOP (T1)
PACK-0007-8/9	Device Orientation for SC70-6L, SC89-6L, TSOP-6 (Single, Dual, Complementary or Dual Symmetrical) (T1)
PACK-0023-1	Device Orientation for MOSFETs, MICRO FOOT 2x2: 0.8-mm Pitch, 0.275-mm Bump Height (T1)
PACK-0023-10	Device Orientation for MICRO FOOT 2x3, 0.5 mm pitch, 0.250 mm bump height (T2)
Tape Information	1206-8 ChipFET®
Tape Information	MICRO FOOT® 2 x 2: 0.8 mm PITCH, 0.275 mm BUMP HEIGHT (Si8401DB-T1, Si8402DB-T1, Si8405DB-T1, and Si8411DB-T1)
Tape Information	MICRO FOOT® 2 x 3: 0.5 mm PITCH, 0.25 mm BUMP HEIGHT
Tape Information	PowerPAK SC70
Tape Information	PowerPAK® 1212
Tape Information	PowerPAK® ChipFET®
Tape Information	PowerPAK® SC-75 AND THIN PowerPAK SC-75
Tape Information	PowerPAK® SOIC-8

Sales, Technical Questions...

Useful Links

Markings [top]
PART MARKING	1206-8 ChipFET and PowerPAK ChipFET
PART MARKING	MICRO FOOT Devices
PART MARKING	SC-70 for Si Part Numbers
PART MARKING	SO-8
PART MARKING	TSOP-5/6
Part Marking Information	devices: PowerPAK® SO-8, PowerPAK SO-8L, PowerPAK 1212-8, PowerPAIR™ 6 x 3.7

Package Drawings [top]
5498	SOIC-8 (Narrow)
5540	TSOP (5L & 6L)
5547	ChipFET (1206-8)
5550	SC-70 6L
5934	PowerPAK SC70-6L
5935	PowerPAK SC75-6L
Package Information	Case Outline FOR PowerPAK® SC70T
Package Information	PowerPAK® 1212, (Single/Dual)
Package Information	PowerPAK® ChipFET® SINGLE PAD
Package Information	PowerPAK® SO-8, (Single/Dual)

Reliability Data [top]
Package Reliability	Environmental and Package Testing Data for ChipFET® (1206-8)
Package Reliability	Environmental and Package Testing Data for MICRO FOOT®
Package Reliability	Environmental and Package Testing Data for PowerPAK® 1212-8
Package Reliability	Environmental and Package Testing Data for PowerPAK® ChipFET®
Package Reliability	Environmental and Package Testing Data for PowerPAK® SC-70
Package Reliability	Environmental and Package Testing Data for PowerPAK® SC-75
Package Reliability	Environmental and Package Testing Data for PowerPAK® SO-8 Solder Process
Package Reliability	Environmental and Package Testing Data for SO-8 Solder Process
Package Reliability	Environmental and Package Testing Data for TSOP-6
Package Reliability	SC-70-6 (Cu)
Silicon Technology Reliability	P-Channel Accelerated Operating Life Test Result

SPICE [top]
H-Spice Model	P-Spice Model (*.lib)	P-Spice Model (*.olb)	P-Spice Model (*.txt)	Spice Model (pdf)
Si3477DV-H Si4497DY-H Si5471DC-H Si7137DP-H Si7145DP-H Si7615DN-H Si7625DN-H Si7629DN-H Si7997DP-H Si8483DB-H Si8487DB-H Si8497DB-H Si8499DB-H SiA433EDJ-H SiA923EDJ-H SiA929DJ-H SiA975DJ-H SiB455EDK-H SiB457EDK-H SiR401DP-H	Si3477DV-P LIB Si4497DY-P LIB Si5471DC-P LIB Si7137DP-P LIB Si7145DP-P LIB Si7615DN-P LIB Si7625DN-P LIB Si7629DN-P LIB Si7997DP-P LIB Si8483DB-P LIB Si8487DB-P LIB Si8497DB-P LIB Si8499DB-P LIB SiA433EDJ-P LIB SiA923EDJ-P LIB SiA929DJ-P LIB SiA975DJ-P LIB SiB455EDK-P LIB SiB457EDK-P LIB SiR401DP-P LIB	Si3477DV-P OLB Si4497DY-P OLB Si5471DC-P OLB Si7137DP-P OLB Si7145DP-P OLB Si7615DN-P OLB Si7625DN-P OLB Si7629DN-P OLB Si7997DP-P OLB Si8483DB-P OLB Si8487DB-P OLB Si8497DB-P OLB Si8499DB-P OLB SiA433EDJ-P OLB SiA923EDJ-P OLB SiA929DJ-P OLB SiA975DJ-P OLB SiB455EDK-P OLB SiB457EDK-P OLB SiR401DP-P OLB	Si3477DV-P Si4497DY-P Si5471DC-P Si7137DP-P Si7145DP-P Si7615DN-P Si7625DN-P Si7629DN-P Si7997DP-P Si8483DB-P Si8487DB-P Si8497DB-P Si8499DB-P SiA433EDJ-P SiA923EDJ-P SiA929DJ-P SiA975DJ-P SiB455EDK-P SiB457EDK-P SiR401DP-P	Si3477DV-DS Si4497DY-DS Si5471DC-DS Si7137DP-DS Si7145DP-DS Si7615DN-DS Si7629DN-DS Si7997DP-DS Si8483DB-DS Si8487DB-DS Si8497DB-DS Si8499DB-DS SiA433EDJ-DS SiA923EDJ-DS SiA929DJ-DS SiA975DJ-DS SiB455EDK-DS SiB457EDK-DS SiR401DP-DS

Application Notes [top]
AN818	Single-Channel TSOP-6, Alternate Package for Products Utilizine the 1206-8 Single-Channel ChipFET

General Information [top]
General Information	Useful Links

Promotional Materials [top]
Product Sheet	Power MOSFET P-channel TrenchFET GEN III

Reel Info [top]
Reel Information	Lok Reel

Related Documents - P-Channel Gen III