Related Documents - Drain-to-source voltage 21 V to 30 V
Application Notes (7)
General Information (1)
Markings (13)
Package Drawings (26)
Pad Guidelines (36)
RC Thermal Models (152)
Reel Info (1)
Reliability Data (37)
Software Models (*.zip) (73)
Tape Info (35)
Tech Tip (16)
SPICE (502)
|
Application Notes
|
|
 AN610 |
PolarPAK Solder Joint Reliability Based On Thermal Fatigue |
| AN611 |
Development of a Lead (Pb)-Free Soldering Process for PolarPAK |
| AN818 |
Single-Channel TSOP-6, Alternate Package for Products Utilizine the 1206-8 Single-Channel ChipFET |
| AN827 |
Torque Recommendations for TO-220 Devices |
| AN828 |
Working with PolarPAK In-Lab Soldering and Re-Working Recommendations |
| AN829 |
PolarPAK Thermal Impedence (Rth) vs. Heat Sink Assembly Clamping Torque |
| Application Note AN821 |
PowerPAK® SO-8 Mounting and Thermal Considerations |
|
General Information
|
|
| General Information |
Useful Links |
|
Markings
|
|
| PART MARKING |
1206-8 ChipFET and PowerPAK ChipFET |
| PART MARKING |
PolarPAK |
| PART MARKING |
SC-70 for Si Part Numbers |
| PART MARKING |
SC-75A and SC-89 Devices |
| PART MARKING |
SO-8 |
| PART MARKING |
SOT-23 |
| PART MARKING |
TSOP-5/6 |
| PART MARKING |
TSSOP-8 |
| Part Marking Information |
devices: TO-220, TO-262, TO-263 (D2PAK, D2PAK-5) |
| Part Marking Information |
MICRO FOOT® |
| Part Marking Information |
MICRO FOOT® 0.8 x 0.8 Devices |
| Part Marking Information |
PowerPAK® SO-8, PowerPAK SO-8L, PowerPAK 1212-8, PowerPAIR® 6 x 3.7, PowerPAK 1212-8S, PowerPAIR 6 x 5, PowerPAIR 3 x 3 |
| Part Marking Information |
TO-252 (DPAK), TO251 |
|
Package Drawings
|
|
| 5479 |
TO-236 (SOT-23) |
| 5498 |
SOIC-8 (Narrow) |
| 5540 |
TSOP (5L & 6L) |
| 5547 |
ChipFET (1206-8) |
| 5549 |
SC-70 3L |
| 5550 |
SC-70 6L |
| 5844 |
TSSOP 8L |
| 5880 |
SC-89 (SOT-563F) 6L |
| 5934 |
PowerPAK SC70-6L |
| 5935 |
PowerPAK SC75-6L |
| 5966 |
PolarPAK® Option U |
| 5967 |
PolarPAK® Option M |
| Package Information |
Case Outline FOR PowerPAK® SC70T |
| Package Information |
PolarPAK® Option L |
| Package Information |
PowerPAIR 6 x 3.7 |
| Package Information |
PowerPAIR® 3 x 3 Case Outline |
| Package Information |
PowerPAIR® 6 x 5 BW Case Outline (for SiZ900DT only) |
| Package Information |
PowerPAIR® 6 x 5 Case Outline |
| Package Information |
PowerPAK® 1212, (Single/Dual) |
| Package Information |
PowerPAK® 1212-8T |
| Package Information |
PowerPAK® ChipFET® Dual PAD |
| Package Information |
PowerPAK® ChipFET® SINGLE PAD |
| Package Information |
PowerPAK® SO-8, (Single/Dual) |
| Package Information |
TO-220AB |
| Package Information |
TO-252AA Case Outline |
| Package Information |
TO-263 (D2PAK): 3-LEAD |
|
Pad Guidelines
|
|
| AN1001 |
LITTLE FOOT TSSOP-8, The Next Step in Surface-Mount Power MO |
| AN806 |
Mounting LITTLE FOOT TSSOP-8 Power MOSFETs |
| AN807 |
Mounting LITTLE FOOT SOT-23 Power MOSFETs |
| AN811 |
Single-Channel 1206-8 ChipFET Power MOSFET Recommended Pad Pattern/Thermal Performance |
| AN812 |
Dual-Channel 1206-8 ChipFET Power MOSFET Recommended Pad Pattern/Thermal Performance |
| AN813 |
Single-Channel LITTLE FOOT SC-70 3-Pin and 6-Pin MOSFET Recommended Pad Pattern/Thermal Performance |
| AN814 |
Dual-Channel LITTLE FOOT SC-70 6-Pin and 6-Pin MOSFET Recommended Pad Pattern/Thermal Performance |
| AN815 |
Single-Channel LITTLE FOOT SC-70 6-Pin MOSFET-Copper Leadframe Recommended Pad Pattern/Thermal Performance |
| AN816 |
Dual-Channel LITTLE FOOT SC-70 6-Pin MOSFET-Copper Leadframe Recommended Pad Pattern/Thermal Performance |
| AN822 |
PowerPAK 1212 Mounting and Thermal Considerations |
| Application Note 826 |
RECOMMENDED MINIMUM PADS FOR 1206-8 ChipFET® |
| Application Note 826 |
RECOMMENDED MINIMUM PADS FOR DPAK (TO-252) |
| Application Note 826 |
RECOMMENDED MINIMUM PADS FOR PolarPAK® Option L and S |
| Application Note 826 |
RECOMMENDED MINIMUM PADS FOR PowerPAK® 1212-8 Dual |
| Application Note 826 |
RECOMMENDED MINIMUM PADS FOR PowerPAK® 1212-8 Single |
| Application Note 826 |
RECOMMENDED minimum pads FOR PowerPAK® ChipFET® Dual |
| Application Note 826 |
RECOMMENDED minimum pads FOR PowerPAK® ChipFET® Single |
| Application Note 826 |
RECOMMENDED MINIMUM PADS FOR PowerPAK® SO-8 Dual |
| Application Note 826 |
RECOMMENDED MINIMUM PADS FOR PowerPAK® SO-8 Single |
| Application Note 826 |
RECOMMENDED MINIMUM PADS FOR SC-70: 3-Lead |
| Application Note 826 |
RECOMMENDED MINIMUM PADS FOR SC-70: 6-Lead |
| Application Note 826 |
RECOMMENDED MINIMUM PADS FOR SC-89: 6-Lead |
| Application Note 826 |
RECOMMENDED MINIMUM PADS FOR SoT-23 |
| Application Note 826 |
RECOMMENDED MINIMUM PADS FOR TSSOP-8 |
| Application Note 826 |
RECOMMENDED pad LAYOUT FOR PowerPAK® Sc70-6L Dual |
| Application Note 826 |
RECOMMENDED PAD LAYOUT FOR PowerPAK® SC70-6L Single |
| Application Note 826 |
RECOMMENDED pad LAYOUT FOR PowerPAK® Sc75-6L Single |
| PAD Pattern |
D2PAK |
| PAD Pattern |
LITTLE FOOT SO-8 Power MOSFETs |
| PAD Pattern |
LITTLE FOOT TSOP-6 Power MOSFETs |
| PAD Pattern |
MICRO FOOT Products |
| PAD Pattern |
PowerPAIR 3 x 3 |
| PAD Pattern |
PowerPAIR 6 x 3.7 |
| PAD Pattern |
PowerPAIR 6 x 5 |
| PAD Pattern |
SO-8 |
| PAD Pattern |
TSOP-6 |
|
RC Thermal Models
|
|
| Document No.69522 |
|
| si1070x-rc |
RC Thermal Model for Si1070X |
| si1072x-rc |
RC Thermal Model for Si1072X |
| Si1302DL-RC |
RC Thermal Model for Si1302DL |
| Si1308EDL-GE3_RC |
R-C Thermal Model Parameters |
| Si1414DH_RC |
R-C Thermal Model Parameters |
| Si1416EDH_RC |
R-C Thermal Model Parameters |
| si1426dh-rc |
RC Thermal Model for Si1426DH |
| Si1428EDH_RC |
R-C Thermal Model Parameters |
| si1470dh-rc |
RC Thermal Model for Si1470DH |
| Si1539CDL_RC |
R-C Thermal Model Parameters |
| si1972dh-rc |
RC Thermal Model for Si1972DH |
| Si2300DS_RC |
R-C Thermal Model Parameters |
| Si2304DDS_RC |
R-C Thermal Model Parameters |
| Si2336DS_RC |
R-C Thermal Model Parameters |
| Si2338DS-GE3_RC |
R-C Thermal Model Parameters |
| Si2366DS_RC |
R-C Thermal Model Parameters |
| si3410dv-rc |
RC Thermal Model for Si3410DV |
| Si3424CDV-GE3_RC |
R-C Thermal Model Parameters |
| Si3456DDV_RC |
R-C Thermal Model Parameters |
| si3552dv-rc |
RC Thermal Model for Si3552DV |
| si3590dv-rc |
RC Thermal Model for Si3590DV |
| Si3932DV_RC |
R-C Thermal Model Parameters |
| Si4048DY_RC |
R-C Thermal Model Parameters |
| Si4116DY_RC |
R-C Thermal Model Parameters |
| Si4126DY_RC |
R-C Thermal Model Parameters |
| Si4128DY_RC |
R-C Thermal Model Parameters |
| Si4156DY_RC |
R-C Thermal Model Parameters |
| Si4160DY_RC |
R-C Thermal Model Parameters |
| Si4162DY_RC |
R-C Thermal Model Parameters |
| Si4164DY_RC |
R-C Thermal Model Parameters |
| Si4166DY_RC |
R-C Thermal Model Parameters |
| Si4168DY_RC |
R-C Thermal Model Parameters |
| Si4172DY_RC |
R-C Thermal Model Parameters |
| Si4174DY_RC |
R-C Thermal Model Parameters |
| Si4178DY_RC |
R-C Thermal Model Parameters |
| Si4200DY_RC |
R-C Thermal Model Parameters |
| Si4202DY_RC |
R-C Thermal Model Parameters |
| Si4210DY_RC |
R-C Thermal Model Parameters |
| Si4214DDY_RC |
R-C Thermal Model Parameters |
| Si4228DY_RC |
R-C Thermal Model Parameters |
| Si4501BDY_RC |
R-C Thermal Model Parameters |
| Si4532CDY |
R-C Thermal Model Parameters |
| si4618dy-rc |
RC Thermal Model for Si4618DY |
| si4620dy-rc |
RC Thermal Model for Si4620DY |
| Si4628DY_RC |
R-C Thermal Model Parameters |
| si4630dy-rc |
RC Thermal Model for Si4630DY |
| si4634dy-rc |
RC Thermal Model for Si4634DY |
| si4654dy-rc |
RC Thermal Model for Si4654DY |
| Si4666DY_RC |
R-C Thermal Model Parameters |
| si4670dy-rc |
RC Thermal Model for Si4670DY |
| Si4712DY_RC |
R-C Thermal Model Parameters |
| Si4774DY_RC |
R-C Thermal Model Parameters |
| Si4776DY_RC |
R-C Thermal Model Parameters |
| si4778dy-rc |
RC Thermal Model for Si4778DY |
| Si4816BDY_RC |
R-C Thermal Model Parameters |
| Si4830CDY_RC |
R-C Thermal Model Parameters |
| si4914bdy-rc |
RC Thermal Model for Si4914BDY |
| si4916dy-rc |
RC Thermal Model for Si4916DY |
| Si4936CDY_RC |
R-C Thermal Model Parameters |
| Si5418DU_RC |
R-C Thermal Model Parameters |
| si5424dc-rc |
RC Thermal Model for Si5424DC |
| Si5440DC_RC |
R-C Thermal Model Parameters |
| Si5458DU_RC |
R-C Thermal Model Parameters |
| Si5468DC_RC |
R-C Thermal Model Parameters |
| si5504bdc-rc |
RC Thermal Model for Si5504BDC |
| si5902bdc-rc |
RC Thermal Model for Si5902BDC |
| si6410dq-rc |
RC Thermal Model for Si6410DQ |
| si6928dq-rc |
RC Thermal Model for Si6928DQ |
| si6954adq-rc |
RC Thermal Model for Si6954ADQ |
| Si7114ADN_RC |
R-C Thermal Model Parameters |
| Si7120ADN_RC |
R-C Thermal Model Parameters |
| si7212dn-rc |
RC Thermal Model for Si7212DN |
| si7224dn-rc |
RC Thermal Model for Si7224DN |
| Si7228DN_RC |
R-C Thermal Model Parameters |
| Si7272DP_RC |
R-C Thermal Model Parameters |
| si7634bdp-rc |
RC Thermal Model for Si7634BDP |
| Si7658ADP_RC |
R-C Thermal Model Parameters |
| Si7716ADN_RC |
R-C Thermal Model Parameters |
| Si7748DP_RC |
R-C Thermal Model Parameters |
| Si7772DP_RC |
R-C Thermal Model Parameters |
| Si7774DP_RC |
R-C Thermal Model Parameters |
| Si7792DP_RC |
R-C Thermal Model Parameters |
| Si7998DP_RC |
R-C Thermal Model Parameters |
| SiA400DJ-GE3_RC |
R-C Thermal Model Parameters |
| SiA432DJ_RC |
R-C Thermal Model Parameters |
| SiA444DJT_RC |
R-C Thermal Model Parameters |
| SiA814DJ_RC |
R-C Thermal Model Parameters |
| SiB408DK_RC |
R-C Thermal Model Parameters |
| SiB410DK_RC |
R-C Thermal Model Parameters |
| SiE726DF_RC |
R-C Thermal Model Parameters |
| SiE844DF_RC |
R-C Thermal Model Parameters |
| SiE848DF_RC |
R-C Thermal Model Parameters |
| SiE860DF_RC |
R-C Thermal Model Parameters |
| SiE862DF_RC |
R-C Thermal Model Parameters |
| SiE878DF_RC |
R-C Thermal Model Parameters |
| SiE882DF_RC |
R-C Thermal Model Parameters |
| SiR158DP_RC |
R-C Thermal Model Parameters |
| SiR166DP_RC |
R-C Thermal Model Parameters |
| SiR172DP_RC |
R-C Thermal Model Parameters |
| SiR330DP_RC |
R-C Thermal Model Parameters |
| SiR402DP_RC |
R-C Thermal Model Parameters |
| SiR406DP_RC |
R-C Thermal Model Parameters |
| SiR408DP_RC |
R-C Thermal Model Parameters |
| SiR412DP_RC |
R-C Thermal Model Parameters |
| SiR428DP_RC |
R-C Thermal Model Parameters |
| SiR436DP_RC |
R-C Thermal Model Parameters |
| SiR438DP_RC |
R-C Thermal Model Parameters |
| SiR460DP_RC |
R-C Thermal Model Parameters |
| SiR462DP_RC |
R-C Thermal Model Parameters |
| SiR466DP_RC |
R-C Thermal Model Parameters |
| SiR468DP_RC |
R-C Thermal Model Parameters |
| SiR472DP_RC |
R-C Thermal Model Parameters |
| SiR770DP_RC |
R-C Thermal Model Parameters |
| SiR774DP_RC |
R-C Thermal Model Parameters |
| SiR818DP_RC |
R-C Thermal Model Parameters |
| SiR820DP_RC |
R-C Thermal Model Parameters |
| SiR850DP_RC |
R-C Thermal Model Parameters |
| SiR862DP_RC |
R-C Thermal Model Parameters |
| SiR864DP_RC |
R-C Thermal Model Parameters |
| SiR892DP_RC |
R-C Thermal Model Parameters |
| SiRA04DP_RC |
R-C Thermal Model Parameters |
| SiRA06DP_RC |
R-C Thermal Model Parameters |
| SiS330DN_RC |
R-C Thermal Model Parameters |
| SiS332DN_RC |
R-C Thermal Model Parameters |
| SiS334DN_RC |
R-C Thermal Model Parameters |
| SiS402DN_RC |
R-C Thermal Model Parameters |
| SiS406DN_RC |
R-C Thermal Model Parameters |
| SiS412DN_RC |
R-C Thermal Model Parameters |
| SiS414DN_RC |
R-C Thermal Model Parameters |
| SiS430DN_RC |
R-C Thermal Model Parameters |
| SiS436DN_RC |
R-C Thermal Model Parameters |
| SiS444DN_RC |
R-C Thermal Model Parameters |
| SiS456DN_RC |
R-C Thermal Model Parameters |
| SiS472DN_RC |
R-C Thermal Model Parameters |
| SiS478DN_RC |
R-C Thermal Model Parameters |
| SiS778DN_RC |
R-C Thermal Model Parameters |
| SiS780DN_RC |
R-C Thermal Model Parameters |
| SiS782DN_RC |
R-C Thermal Model Parameters |
| SiSA04DN_RC |
R-C Thermal Model Parameters |
| SiZ702DT_RC |
R-C Thermal Model Parameters |
| SiZ704DT_RC |
R-C Thermal Model Parameters |
| SiZ728DT_RC |
R-C Thermal Model Parameters |
| SiZ730DT_RC |
R-C Thermal Model Parameters |
| SiZ790DT_RC |
R-C Thermal Model Parameters |
| SiZ900DT_RC |
R-C Thermal Model Parameters |
| SUD42N03-3m9P_RC |
R-C Thermal Model Parameters |
| sud50n03-12p-rc |
RC Thermal Model for SUD50N03-12P |
| sum90n03-2m2p-rc |
RC Thermal Model for SUM90N03-2m2P |
| SUP50N03-5m1P_RC |
R-C Thermal Model Parameters |
| SUP85N03-3m6P_RC |
R-C Thermal Model Parameters |
| SUP90N03-03_RC |
R-C Thermal Model Parameters |
|
Reel Info
|
|
| Reel Information |
Lok Reel |
|
Reliability Data
|
|
| Package Reliability |
Environmental and Package Testing Data for ChipFET® (1206-8) |
| Package Reliability |
Environmental and Package Testing Data for D2PAK, TO-263 |
| Package Reliability |
Environmental and Package Testing Data for DPAK, TO-252, TO-251 |
| Package Reliability |
Environmental and Package Testing Data for MICRO FOOT® |
| Package Reliability |
Environmental and Package Testing Data For PolarPAK |
| Package Reliability |
Environmental and Package Testing Data for PowerPAIR® 3 x 3 |
| Package Reliability |
Environmental and Package Testing Data for PowerPAIR® 6 x 3.7 |
| Package Reliability |
Environmental and Package Testing Data for PowerPAIR® 6 x 5 |
| Package Reliability |
Environmental and Package Testing Data for PowerPAK® 1212-8 |
| Package Reliability |
Environmental and Package Testing Data for PowerPAK® ChipFET® |
| Package Reliability |
Environmental and Package Testing Data for PowerPAK® SC-70 |
| Package Reliability |
Environmental and Package Testing Data for PowerPAK® SC-75 |
| Package Reliability |
Environmental and Package Testing Data for PowerPAK® SO-8 |
| Package Reliability |
Environmental and Package Testing Data for PowerPAK® SO-8 Solder Process |
| Package Reliability |
Environmental and Package Testing Data for SC-70 |
| Package Reliability |
Environmental and Package Testing Data for SC-89 |
| Package Reliability |
Environmental and Package Testing Data for SO-8 |
| Package Reliability |
Environmental and Package Testing Data for SO-8 Solder Process |
| Package Reliability |
Environmental and Package Testing Data for SSOT-23 |
| Package Reliability |
Environmental and Package Testing Data for Thin PowerPAK 1212-8 |
| Package Reliability |
Environmental and Package Testing Data For TO-220 |
| Package Reliability |
Environmental and Package Testing Data for TSOP-6 |
| Package Reliability |
Environmental and Package Testing Data for TSSOP-8 |
| Package Reliability |
SC-70-6 (Cu) |
| Silicon Technology Reliability |
N-Channel Accelerated Operating Life Test Result |
| Silicon Technology Reliability |
N-Channel Accelerated Operating Life Test Result |
| Silicon Technology Reliability |
N-Channel Accelerated Operating Life Test Result |
| Silicon Technology Reliability |
N-Channel Accelerated Operating Life Test Result |
| Silicon Technology Reliability |
N-Channel Accelerated Operating Life Test Result |
| Silicon Technology Reliability |
N-Channel Accelerated Operating Life Test Result |
| Silicon Technology Reliability |
N-Channel Accelerated Operating Life Test Result |
| Silicon Technology Reliability |
N-Channel Accelerated Operating Life Test Result |
| Silicon Technology Reliability |
P-Channel Accelerated Operating Life Test Result |
| Silicon Technology Reliability |
P-Channel Accelerated Operating Life Test Result |
| Silicon Technology Reliability |
P-Channel Accelerated Operating Life Test Result |
| Silicon Technology Reliability |
Schottky Diode Accelerated Operating Life Test Result |
| Silicon Technology Reliability |
SkyFET® (N-Channel MOSFET and Schottky Diode) Accelerated Operating Life Test Result |
|
Software Models (*.zip)
|
|
| Si1416EDH-zip |
SPICE Models for Si1416EDH |
| Si1428EDH-zip |
SPICE Models for Si1428EDH |
| Si1539CDL-zip |
SPICE Models for Si1539CDL |
| Si3410DV-zip |
Spice Models for Si3410DV |
| Si3424CDV-zip |
Spice Models for Si3424CDV |
| Si3456DDV-zip |
SPICE Models for Si3456DDV |
| Si4048DY-zip |
SPICE Models for Si4048DY |
| Si4116DY-zip |
SPICE Models for Si4116DY |
| Si4126DY-zip |
SPICE Models for Si4126DY |
| Si4156DY-zip |
SPICE Models for Si4156DY |
| Si4160DY-zip |
SPICE Models for Si4160DY |
| Si4162DY-zip |
SPICE Models for Si4162DY |
| Si4164DY-zip |
Spice Models for Si4164DY |
| Si4166DY-zip |
Spice Models for Si4166DY |
| Si4172DY-zip |
Spice Models for Si4172DY |
| Si4174DY-zip |
Spice Models for Si4174DY |
| Si4178DY-zip |
SPICE Model for Si4178DY |
| Si4630DY-zip |
SPICE Models for Si4630DY |
| Si4634DY-zip |
Spice Models for Si4634DY |
| Si4654DY-zip |
SPICE Models for Si4654DY |
| Si4666DY-zip |
SPICE Models for Si4666DY |
| Si4778DY-zip |
SPICE Models for Si4778DY |
| Si5418DU-zip |
Spice Models for Si5418DU |
| Si5424DC-zip |
Spice Models for Si5424DC |
| Si5440DC-zip |
Spice Models for Si5440DC |
| Si5458DU-zip |
SPICE Models for Si5458DU |
| Si5468DC-zip |
SPICE Models for Si5468DC |
| Si7114ADN-zip |
Spice Models for Si7114ADN |
| Si7634BDP-zip |
SPICE Models for Si7634BDP |
| Si7658ADP-zip |
Spice Models for Si7658ADP |
| Si7716ADN-zip |
Spice Models for Si7716ADN |
| Si8808DB-zip |
SPICE Models for Si8808DB |
| SiA408DJ-zip |
Spice Models for SiA408DJ |
| SiA432DJ-zip |
Spice Models for SiA432DJ |
| SiA444DJT-zip |
SPICE Models for SiA444DJT |
| SiB408DK-zip |
SPICE Models for SiB408DK |
| SiB410DK-zip |
SPICE Models for SiB410DK |
| SiR158DP-zip |
SPICE Models for SiR158DP |
| SiR166DP-zip |
SPICE Models for SiR166DP |
| SiR172ADP-zip |
SPICE Models for SiR172ADP |
| SiR172DP-zip |
SPICE Models for SiR172DP |
| SiR316DP-zip |
SPICE Models for SiR316DP |
| SiR402DP-zip |
SPICE Models for SiR402DP |
| SiR406DP-zip |
Spice Models for SiR406DP |
| SiR408DP-zip |
Spice Models for SiR408DP |
| SiR412DP-zip |
Spice Models for SiR412DP |
| SiR436DP-zip |
Spice Models for SiR436DP |
| SiR438DP-zip |
Spice Models for SiR438DP |
| SiR460DP-zip |
Spice Models for SiR460DP |
| SiR462DP-zip |
SPICE Models for SiR462DP |
| SiR466DP-zip |
SPICE Models for SiR466DP |
| SiR468DP-zip |
SPICE Models for SiR468DP |
| SiR472DP-zip |
SPICE Models for SiR472DP |
| SiR770DP |
SPICE Models for SiR770DP |
| SiR788DP-zip |
SPICE Models for SiR788DP |
| SiR850DP-zip |
SPICE Models for SiR850DP |
| SiR892DP-zip |
SPICE Models for SiR892DP |
| SiRA02DP-zip |
SPICE Models for SiRA02DP |
| SiRA04DP-zip |
SPICE Models for SiRA04DP |
| SiRA12DP-zip |
SPICE Models for SiRA12DP |
| SiRA14DP-zip |
SPICE Models for SiRA14DP |
| SiRA34DP-zip |
Spice Models for SiRA34DP |
| SiS402DN-zip |
SPICE Models for SiS402DN |
| SiS406DN-zip |
SPICE Models for SiS406DN |
| SiS430DN-zip |
Spice Models for SiS430DN |
| sis436dn-zip |
Spice Models for SiS436DN |
| SiS472ADN-zip |
SPICE Models for SiS472ADN |
| SiSA04DN-zip |
SPICE Models for SiSA04DN |
| SiZ900DT-zip |
SPICE Models for SiZ900DT |
| SiZ918DT-zip |
SPICE Models for SiZ918DT |
| SUD42N03-3m9P-zip |
SPICE Models for SUD42N03-3m9P |
| SUD50N03-12P-zip |
Spice Models for SUD50N03-12P |
| SUM90N03-2m2P-zip |
SPICE Models for SUM90N03-2m2P |
|
Tape Info
|
|
| 90-2339-1 |
Tape Drawing for TO-252 (DPAK) (T1 Method) |
| 90-2342-x |
TO-263 (D2PAK): 3- and 5-lead |
| 90-2345-X |
Tape Drawing for TSSOP: 8 Lead (16 mm) |
| 90-2369-x |
Tape Drawing for TO-252 (DPAK) (T4 Method) |
| 90-2377-1 |
Tape Drawing for SC-89 6L (TO-563) Flat |
| 91-5209-x |
Tape Drawing for SOIC PACKAGES (NARROW AND WIDE BODY) |
| 91-5209-x |
Tape Drawing for SOT-23 (T1 and T2 Methods) |
| 93-2345-X |
TSOP: 5/6-Lead (SC-59) |
| 93-5213-X |
SC-70 3-LEADS (T2-METHOD) |
| Device Orientation |
Device Orientation for PowerPAK 1212-8, PowerPAK 1212-8S, and PowerPAK SO-1 |
| Device Orientation |
Device Orientation for PowerPAK SC-70 |
| Device Orientation |
Device Orientation for PowerPAIR |
| Device Orientation |
Device OrientationPowerPAK® SC-70, PowerPAK SC-75,Thin PowerPAK SC-70, Thin PowerPAK SC-75 |
| PACK-0007-13 |
Device Orientation for 1206-8 ChipFET (T1) |
| PACK-0007-2 |
Device Orientation for SC70-3L, SC75A, SC89-3L, and SOT-23 (T1) |
| PACK-0007-21 |
Device Orientation for PolarPAK (T1) |
| PACK-0007-6 |
Device Orientation for MSOP, SOIC, SSOP, and TSSOP (T1) |
| PACK-0007-8/9 |
Device Orientation for SC70-6L, SC89-6L, TSOP-6 (Single, Dual, Complementary or Dual Symmetrical) (T1) |
| PACK-0020- |
Device Orientation for TO-252 and Reverse TO-252 (T4) |
| PACK-0020- |
Device Orientation for TO-252, Reverse TO-252 and TO-251 Short Lead (T1) |
| PACK-0020- |
Device Orientation for TO-263 (T1) |
| PACK-0023-3 |
Device Orientation for MOSFETs, MICRO FOOT 2x3: 0.8-mm Pitch, 0.275-mm Bump Height (T2) |
| Tape Information |
1206-8 ChipFET® |
| Tape Information |
MICRO FOOT® 2 x 3: 0.8 mm PITCH, 0.275 mm BUMP HEIGHT (Si8407DB-T2, Si8902EDB-T2) |
| Tape Information |
MICROFOOT 0.8 x 0.8 CARRIER TAPE |
| Tape Information |
PolarPAK® Carrier Tape |
| Tape Information |
PowerPAIR 6 x 3.7 CARRIER TAPE |
| Tape Information |
PowerPAIR 6 x 5 CARRIER TAPE |
| Tape Information |
PowerPAK SC70 |
| Tape Information |
PowerPAK® 1212 |
| Tape Information |
PowerPAK® ChipFET® |
| Tape Information |
PowerPAK® SC-75 AND THIN PowerPAK SC-75 |
| Tape Information |
PowerPAK® SOIC-8 |
| Tape Information |
SC-70 3-LEADS (T1-METHOD) |
| Tape Information |
Tape Drawing for PowerPAK®, MLP(QFN), 4 x 4/3 x 3, DFN-10, 3 x 3, MLP33-8/10 |
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