Si5857DU product information
P-Channel 20-V (D-S) MOSFET with Schottky Diode

 Si5857DU Datasheet


Si5857DU Press Release
Check all PDF documents

Documents

Datasheet
Si5857DU
Markings
PART MARKING - 1206-8 ChipFET and PowerPAK ChipFET
Package Drawing
Package Information - PowerPAK® ChipFET® Dual Pad
Pad Guidelines
Application Note 826 - RECOMMENDED minimum pads FOR PowerPAK? ChipFET? Dual
RC Thermal Models
Si5857DU-RC - RC Thermal Model for Si5857DU
Reel Info
Reel Information - Lok Reel
Reliability Data
Package Reliability - Environmental and Package Testing Data For PowerPAK ChipFET
Silicon Technology Reliability - Schottky Diode Accelerated Operating Life Test Result
Silicon Technology Reliability - P-Channel Accelerated Operating Life Test Result
Tape Info
93_5248_x - Tape Drawing for PowerPAK ChipFET
PACK-0007-13 - Device Orientation for 1206-8 ChipFET (T1)
Spice Model (pdf)
Si5857DU-DS - DS-Spice Model for Si5857DU
H-Spice Model
Si5857DU-H - H-Spice Model for Si5857DU
P-Spice Model (*.lib)
Si5857DU-P LIB - LIB for P-Spice Model for Si5857DU
P-Spice Model (*.olb)
Si5857DU-P OLB - OLB for P-Spice Model for Si5857DU
P-Spice Model (*.txt)
Si5857DU-P - P-Spice Model for Si5857DU
Combine Checked Documents Into One PDF
Product Support
Sample Request
If you haven't already registered, you must register to submit a request.

* = required
* Part Number
Part Description
DocID
* Quantity
* Project Name
* Estimated Annual Use
Customer Material Number
Start of Production
 
Notes


Technical Questions
Vishay engineers can answer questions about product quality, performance, and specifications.

If you haven't already registered, you must register to submit a request.

* Subject
* Message

Javascript must be enabled