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SiHB33N60E product information

E Series Power MOSFET

 SiHB33N60E Datasheet

FEATURES

  • Low figure-of-merit (FOM): Ron x Qg
  • Low input capacitance (Ciss)
  • Reduced switching and conduction losses


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Documents

Datasheet
General Information
General Information - Useful Web Links
Package Drawings
Package Information - TO-263AB (High Voltage)
Pad Guidelines
PAD Pattern - D2PAK
Product Literature
Product Sheet - 500 V, 600 V, and 650 V High-Performance Superjunction MOSFETs
RC Thermal Models
SiHB33N60E_RC - R-C Thermal Model Parameters
Reliability Data
Package Reliability - Environmental and Package Testing Data for D2PAK (TO-263) (HVM)
Silicon Technology Reliability - N-Channel Accelerated Operating Life Test Result
Tape Info
Device Orientation - Device Orientation for TO-252 and TO-263 (T5)
PACK-0020- - Device Orientation for TO-263 (T1)
SPICE Models (*.pdf)
SiHB33N60E-DS - DS-SPICE Model for SiHB33N60E
SPICE Models (*.zip)
SiHB33N60E-zip - SPICE Models for SiHB33N60E
Product Support
Technical Questions
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