Markings (1)
  Pad Guidlines (5)
  Package Drawing (2)
  Reliability Data (4)
  Reel Info (1)
  RC Thermal Models (4)
  Tape Info (5)
  SPICE (15)

Markings
PART MARKING	MICRO FOOT Devices

Pad Guidlines
AN824	PCB Design and Assembly Guidelines for MICRO FOOT Products
AN826 - PowerPAK SC70 Single	Recommended Minimum PAD Pattern
AN826 - PowerPAK SC75 Single	Recommended Minimum PAD Pattern
Application Note 826	RECOMMENDED PAD LAYOUT FOR PowerPAK? SC70-6L Single
Application Note 826	RECOMMENDED pad LAYOUT FOR PowerPAK? Sc75-6L Single

Package Drawing
5934	PowerPAK SC70-6L
5935	PowerPAK SC75-6L

Reliability Data
Package Reliability	Environmental and Package Testing Data For MICRO FOOT (0.8 mm Pitch)
Package Reliability	Environmental and Package Testing Data For PowerPAK SC-75
Package Reliability	Environmental and Package Testing Data For PowerPAK SC-70
Silicon Technology Reliability	N-Channel Accelerated Operating Life Test Result

Reel Info
Reel Information	LOK REEL

RC Thermal Models
Si8424DB-RC	RC Thermal Model for Si8424DB
SiA414DJ-RC	RC Thermal Model for SiA414DJ
SiB414DK-RC	RC Thermal Model for SiB414DK
SiB414DK_RC	R-C Thermal Model Parameters

Tape Info
93-5222-x	Tape Drawing for MICRO FOOT 2x2, 0.8 mm Pitch, 0.275 mm bump height
93-5240-x	Tape Drawing for PowerPAK SC-70
93-5241-x	Tape Drawing for PowerPAK SC-75
PACK-0007-21	Device Orientation for PowerPAK SC-70, PowerPAK SC-75
PACK-0023-1	Device Orientation for MOSFETs, MICRO FOOT 2x2: 0.8-mm Pitch, 0.275-mm Bump Height (T1)

SPICE
H-SPICE	P-SPICE	P-SPICE (*.olb)	P-SPICE (*.lib)	SPICE PDF
Si8424DB-H  SiA414DJ-H  SiB414DK-H	Si8424DB-P  SiA414DJ-P  SiB414DK-P	Si8424DB-P OLB  SiA414DJ-P OLB  SiB414DK-P OLB	Si8424DB-P LIB  SiA414DJ-P LIB  SiB414DK-P LIB	Si8424DB-DS  SiA414DJ-DS  SiB414DK-DS