Markings (4)
  Pad Guidlines (16)
  Package Drawing (7)
  Reliability Data (12)
  Reel Info (1)
  RC Thermal Models (10)
  Tape Info (12)
  SPICE (15)

Markings
PART MARKING	PowerPAK SO-8, PowerPAK 1212-8
PART MARKING	1206-8 ChipFET and PowerPAK ChipFET
PART MARKING	TSOP-5/6
PART MARKING	SO-14, SO-16, S0-20, S0-24, and SO-28 Narrow and Wide Body Devices

Pad Guidlines
AN821	PowerPAK SO-8 Mounting and Thermal Considerations
AN823	Mounting LITTLE FOOT TSOP-6 Power MOSFETs
AN826 - 1206-8 ChipFET	Recommended Minimum PAD Pattern
AN826 - PowerPAK ChipFET Single	Recommended Minimum PAD Pattern
AN826 - PowerPAK SC70 Dual	Recommended Minimum PAD Pattern
AN826 - PowerPAK SC75 Dual	Recommended Minimum PAD Pattern
AN826 - PowerPAK SO-8 Dual	Recommended Minimum PAD Pattern
AN826 - SO-14	Recommended Minimum PAD Pattern
AN826 - TSOP-6	Recommended Minimum PAD Pattern
Application Note 826	RECOMMENDED minimum pads FOR PowerPAK? ChipFET? Single
Application Note 826	RECOMMENDED pad LAYOUT FOR PowerPAK? Sc70-6L Dual
Application Note 826	RECOMMENDED pad LAYOUT FOR PowerPAK? Sc75-6L Dual
Application Note 826	RECOMMENDED MINIMUM PADS FOR 1206-8 ChipFET?
Application Note 826	RECOMMENDED MINIMUM PADS FOR PowerPAK? SO-8 Dual
Application Note 826	RECOMMENDED MINIMUM PADS FOR SO-14
Application Note 826	RECOMMENDED MINIMUM PADS FOR TSOP-6

Package Drawing
5499	SOIC-14 (Narrow)
5540	TSOP (5L & 6L)
5547	ChipFET (1206-8)
5934	PowerPAK SC70-6L
5935	PowerPAK SC75-6L
5940	PowerPAK ChipFET Single Pad
Package Information	PowerPAK? SO-8, (Single/Dual)

Reliability Data
Package Reliability	Environmental and Package Testing Data For 1206-8 ChipFET
Package Reliability	Environmental and Package Testing Data For SOIC 14-28 Lead
Package Reliability	Environmental and Package Testing Data For PowerPAK SO-8
Package Reliability	PowerPAK SO-8
Package Reliability	Environmental and Package Testing Data For TSOP-5/6
Package Reliability	Environmental and Package Testing Data For PowerPAK ChipFET
Package Reliability	Environmental and Package Testing Data For PowerPAK SC-75
Package Reliability	Environmental and Package Testing Data For PowerPAK SC-70
Silicon Technology Reliability	N-Channel Accelerated Operating Life Test Result
Silicon Technology Reliability	Accelerated Operating Life Test Result
Silicon Technology Reliability	N-Channel Accelerated Operating Life Test Result
Silicon Technology Reliability	Schottky Diode Accelerated Operating Life Test Result

Reel Info
Reel Information	LOK REEL

RC Thermal Models
Si3812DV-RC	RC Thermal Model for Si3812DV
Si4340CDY-RC	RC Thermal Model for Si4340CDY
Si4340CDY_RC	R-C Thermal Model Parameters
Si5856DC-RC	RC Thermal Model for Si5856DC
Si5858DU-RC	RC Thermal Model for Si5858DU
Si7980DP-RC	RC Thermal Model for Si7980DP
Si7980DP_RC	R-C Thermal Model Parameters
SiA810DJ-RC	RC Thermal Model for SiA810DJ
SiB800EDK-RC	RC Thermal Model for SiB800EDK
SiB800EDK_RC	R-C Thermal Model Parameters

Tape Info
90-2378-1	Tape Drawing for PowerPAK SO-8
91-5209-x	Tape Drawing for SOIC (8L, 14L, 16L Narrow & 14L, 20L, 24L Wide)
93-2345-x	Tape Drawing for TSOP-6
93-2346-x	Tape Drawing for ChipFET (1206-8)
93-5240-x	Tape Drawing for PowerPAK SC-70
93-5241-x	Tape Drawing for PowerPAK SC-75
93_5248_x	Tape Drawing for PowerPAK ChipFET
PACK-0007-13	Device Orientation for 1206-8 ChipFET (T1)
PACK-0007-14	Device Orientation for PowerPAK 1212-8 and PowerPAK SO-8 (T1)
PACK-0007-21	Device Orientation for PowerPAK SC-70, PowerPAK SC-75
PACK-0007-6	Device Orientation for MSOP, SOIC, SSOP, and TSSOP (T1)
PACK-0007-8/9	Device Orientation for SC70-6L, SC89-6L, TSOP-6 (Single, Dual, Complementary or Dual Symmetrical) (T1)

SPICE
H-SPICE	P-SPICE	P-SPICE (*.olb)	P-SPICE (*.lib)	SPICE PDF
Si5856DC-H  Si5858DU-H  SiA810DJ-H	Si5856DC-P  Si5858DU-P  SiA810DJ-P	Si5856DC-P OLB  Si5858DU-P OLB  SiA810DJ-P OLB	Si5856DC-P LIB  Si5858DU-P LIB  SiA810DJ-P LIB	Si5856DC-DS  Si5858DU-DS  SiA810DJ-DS