Application Note (1)
  Markings (4)
  Pad Guidlines (15)
  Package Drawing (5)
  Reliability Data (8)
  Reel Info (1)
  RC Thermal Models (9)
  Tape Info (10)
  SPICE (28)

Application Note
AN818	Single-Channel TSOP-6, Alternate Package for Products Utilizine the 1206-8 Single-Channel ChipFET

Markings
PART MARKING	1206-8 ChipFET and PowerPAK ChipFET
PART MARKING	SC-75A and SC-89 Devices
PART MARKING	MICRO FOOT Devices
PART MARKING	SC-70 for Si Part Numbers

Pad Guidlines
AN812	Dual-Channel 1206-8 ChipFET Power MOSFET Recommended Pad Pattern/Thermal Performance
AN815	Single-Channel LITTLE FOOT SC-70 6-Pin MOSFET-Copper Leadframe Recommended Pad Pattern/Thermal Performance
AN824	PCB Design and Assembly Guidelines for MICRO FOOT Products
AN826 - 1206-8 ChipFET	Recommended Minimum PAD Pattern
AN826 - PowerPAK SC70 Single	Recommended Minimum PAD Pattern
AN826 - PowerPAK SC75 Dual	Recommended Minimum PAD Pattern
AN826 - PowerPAK SC75 Single	Recommended Minimum PAD Pattern
AN826 - SC-70: 6-Lead	Recommended Minimum PAD Pattern
AN826 - SC-89: 6-Lead	Recommended Minimum PAD Pattern
Application Note 826	RECOMMENDED PAD LAYOUT FOR PowerPAK? SC70-6L Single
Application Note 826	RECOMMENDED pad LAYOUT FOR PowerPAK? Sc75-6L Single
Application Note 826	RECOMMENDED pad LAYOUT FOR PowerPAK? Sc75-6L Dual
Application Note 826	RECOMMENDED MINIMUM PADS FOR 1206-8 ChipFET?
Application Note 826	RECOMMENDED MINIMUM PADS FOR SC-70: 6-Lead
Application Note 826	RECOMMENDED MINIMUM PADS FOR SC-89: 6-Lead

Package Drawing
5547	ChipFET (1206-8)
5550	SC-70 6L
5880	SC-89 (SOT-563F) 6L
5934	PowerPAK SC70-6L
5935	PowerPAK SC75-6L

Reliability Data
Package Reliability	SC-70-6 (Cu)
Package Reliability	Environmental and Package Testing Data For 1206-8 ChipFET
Package Reliability	Environmental and Package Testing Data For MICRO FOOT (0.8 mm Pitch)
Package Reliability	Environmental and Package Testing Data For SC-89
Package Reliability	Environmental and Package Testing Data For PowerPAK SC-75
Package Reliability	Environmental and Package Testing Data For PowerPAK SC-70
Silicon Technology Reliability	N-Channel Accelerated Operating Life Test Result
Silicon Technology Reliability	N-Channel Accelerated Operating Life Test Result

Reel Info
Reel Information	LOK REEL

RC Thermal Models
Si1050X-RC	RC Thermal Model for Si1050X
Si1450DH-RC	RC Thermal Model for Si1450DH
Si5920DC-RC	RC Thermal Model for Si5920DC
Si8424DB-RC	RC Thermal Model for Si8424DB
SiA414DJ-RC	RC Thermal Model for SiA414DJ
SiB414DK-RC	RC Thermal Model for SiB414DK
SiB414DK_RC	R-C Thermal Model Parameters
SiB800EDK-RC	RC Thermal Model for SiB800EDK
SiB800EDK_RC	R-C Thermal Model Parameters

Tape Info
90-2377-1	Tape Drawing for SC-89 6L (TO-563) Flat
93-2346-x	Tape Drawing for ChipFET (1206-8)
93-5213-1	Tape Drawing for SC-70 5L/6L
93-5222-x	Tape Drawing for MICRO FOOT 2x2, 0.8 mm Pitch, 0.275 mm bump height
93-5240-x	Tape Drawing for PowerPAK SC-70
93-5241-x	Tape Drawing for PowerPAK SC-75
PACK-0007-13	Device Orientation for 1206-8 ChipFET (T1)
PACK-0007-21	Device Orientation for PowerPAK SC-70, PowerPAK SC-75
PACK-0007-8/9	Device Orientation for SC70-6L, SC89-6L, TSOP-6 (Single, Dual, Complementary or Dual Symmetrical) (T1)
PACK-0023-1	Device Orientation for MOSFETs, MICRO FOOT 2x2: 0.8-mm Pitch, 0.275-mm Bump Height (T1)

SPICE
H-SPICE	P-SPICE	P-SPICE (*.olb)	P-SPICE (*.lib)	SPICE PDF
Si1050X-H  Si1450DH-H  Si5920DC-H  Si8424DB-H  SiA414DJ-H  SiB414DK-H	Si1050X-P  Si1450DH-P  Si5920DC-P  Si8424DB-P  SiA414DJ-P  SiB414DK-P	Si1050X-P OLB  Si1450DH-P OLB  Si8424DB-P OLB  SiA414DJ-P OLB  SiB414DK-P OLB	Si1050X-P LIB  Si1450DH-P LIB  Si8424DB-P LIB  SiA414DJ-P LIB  SiB414DK-P LIB	Si1050X-DS  Si1450DH-DS  Si5920DC-DS  Si8424DB-DS  SiA414DJ-DS  SiB414DK-DS