Markings (1)
  Pad Guidlines (2)
  Package Drawing (1)
  Reliability Data (3)
  Reel Info (1)
  Technical Note (2)
  RC Thermal Models (4)
  Tape Info (4)
  SPICE (12)

Markings
PART MARKING	TO-252 (DPAK), TO-251

Pad Guidlines
AN826 - DPAK (TO-252)	Recommended Minimum PAD Pattern
Application Note 826	RECOMMENDED MINIMUM PADS FOR DPAK (TO-252)

Package Drawing
5347	TO-252 (DPAK)

Reliability Data
Package Reliability	Environmental and Package Testing Data For TO-251/252 and Reverse TO-252 (DPAK)
Silicon Technology Reliability	Accelerated Operating Life Test Result
Silicon Technology Reliability	N-Channel Accelerated Operating Life Test Result

Reel Info
Reel Information	LOK REEL

Technical Note
Document No. 74243
Document No. 74247

RC Thermal Models
SUD50N02-04P-RC	RC Thermal Model for SUD50N02-04P
SUD50N03-06AP-RC	RC Thermal Model for SUD50N03-06AP
SUD50N03-12P-RC	RC Thermal Model for SUD50N03-12P
SUD50N03-16P-RC	RC Thermal Model for SUD50N03-16P

Tape Info
90-2339-1	Tape Drawing for TO-252 (DPAK) (T1 Method)
90-2369-x	Tape Drawing for TO-252 (DPAK) (T4 Method)
PACK-0020-	Device Orientation for TO-252, Reverse TO-252 and TO-251 Short Lead (T1)
PACK-0020-	Device Orientation for TO-252 and Reverse TO-252 (T4)

SPICE
H-SPICE	P-SPICE	P-SPICE (*.olb)	P-SPICE (*.lib)	SPICE PDF
SUD50N02-04P-H  SUD50N03-06AP-H	SUD50N02-04P-P  SUD50N03-06AP-P	SUD50N02-04P-P OLB  SUD50N03-06AP-P OLB	SUD50N02-04P-P LIB  SUD50N03-06AP-P LIB	SUD50N02-04P-DS  SUD50N03-06AP-DS  SUD50N03-12P-DS  SUD50N03-16P-DS