Markings (1)
  Pad Guidlines (1)
  Reliability Data (4)
  Reel Info (1)
  RC Thermal Models (5)
  Tape Info (6)
  SPICE (25)

Markings
PART MARKING	MICRO FOOT Devices

Pad Guidlines
AN824	PCB Design and Assembly Guidelines for MICRO FOOT Products

Reliability Data
Package Reliability	Environmental and Package Testing Data For MICRO FOOT (0.8 mm Pitch)
Silicon Technology Reliability	N-Channel Accelerated Operating Life Test Result
Silicon Technology Reliability	Accelerated Operating Life Test Result
Silicon Technology Reliability	N-Channel Accelerated Operating Life Test Result

Reel Info
Reel Information	LOK REEL

RC Thermal Models
Si8402DB-RC	RC Thermal Model for Si8402DB
Si8424DB-RC	RC Thermal Model for Si8424DB
Si8900EDB-RC	RC Thermal Model for Si8900EDB
Si8902EDB-RC	RC Thermal Model for Si8902EDB
Si8904EDB-RC	RC Thermal Model for Si8904EDB

Tape Info
93-5222-x	Tape Drawing for MICRO FOOT 2x2, 0.8 mm Pitch, 0.275 mm bump height
93-5223-x	Tape Drawing for MICRO FOOT 2x3, 0.8 mm Pitch, 0.275 mm bump height
93-5224-x	Tape Drawing for MICRO FOOT 2x5, 0.8 mm Pitch, 0.275 mm bump height
PACK-0023-1	Device Orientation for MOSFETs, MICRO FOOT 2x2: 0.8-mm Pitch, 0.275-mm Bump Height (T1)
PACK-0023-2	Device Orientation for MOSFETs, MICRO FOOT 2x5: 0.8-mm Pitch, 0.275-mm Bump Height (T2)
PACK-0023-3	Device Orientation for MOSFETs, MICRO FOOT 2x3: 0.8-mm Pitch, 0.275-mm Bump Height (T2)

SPICE
H-SPICE	P-SPICE	P-SPICE (*.olb)	P-SPICE (*.lib)	SPICE PDF
Si8402DB-H  Si8424DB-H  Si8900EDB-H  Si8902EDB-H  Si8904EDB-H	Si8402DB-P  Si8424DB-P  Si8900EDB-P  Si8902EDB-P  Si8904EDB-P	Si8402DB-P OLB  Si8424DB-P OLB  Si8900EDB-P OLB  Si8902EDB-P OLB  Si8904EDB-P OLB	Si8402DB-P LIB  Si8424DB-P LIB  Si8900EDB-P LIB  Si8902EDB-P LIB  Si8904EDB-P LIB	Si8402DB-DS  Si8424DB-DS  Si8900EDB-DS  Si8902EDB-DS  Si8904EDB-DS