Related Documents - MOSFET + Schottky Combo

  General Information (1)
  Markings (4)
  Package Drawings (8)
  Pad Guidelines (12)
  RC Thermal Models (18)
  Reel Info (1)
  Reliability Data (15)
  Tape Info (14)
  Technical Notes (7)
  SPICE (65)

General Information [top]
General Information	Useful Links

Markings [top]
PART MARKING	1206-8 ChipFET and PowerPAK ChipFET
PART MARKING	SO-8
PART MARKING	TSOP-5/6
Part Marking Information	devices: PowerPAK® SO-8, PowerPAK SO-8L, PowerPAK 1212-8, PowerPAIR™ 6 x 3.7

Package Drawings [top]
5498	SOIC-8 (Narrow)
5540	TSOP (5L & 6L)
5547	ChipFET (1206-8)
5934	PowerPAK SC70-6L
5935	PowerPAK SC75-6L
Package Information	PowerPAIR 6 x 3.7
Package Information	PowerPAK® 1212, (Single/Dual)
Package Information	PowerPAK® SO-8, (Single/Dual)

Pad Guidelines [top]
AN821	PowerPAK SO-8 Mounting and Thermal Considerations
AN822	PowerPAK 1212 Mounting and Thermal Considerations
Application Note 826	RECOMMENDED MINIMUM PADS FOR 1206-8 ChipFET®
Application Note 826	RECOMMENDED MINIMUM PADS FOR PowerPAK® 1212-8 Dual
Application Note 826	RECOMMENDED MINIMUM PADS FOR PowerPAK® SO-8 Dual
Application Note 826	RECOMMENDED pad LAYOUT FOR PowerPAK® Sc70-6L Dual
Application Note 826	RECOMMENDED pad LAYOUT FOR PowerPAK® Sc75-6L Dual
PAD Pattern	LITTLE FOOT SO-8 Power MOSFETs
PAD Pattern	LITTLE FOOT TSOP-6 Power MOSFETs
PAD Pattern	PowerPAIR 6 x 3.7
PAD Pattern	SO-8
PAD Pattern	TSOP-6

RC Thermal Models [top]
Si3805DV-RC	RC Thermal Model for Si3805DV
Si3805DV_RC	R-C Thermal Model Parameters
Si4618DY-RC	RC Thermal Model for Si4618DY
Si4620DY-RC	RC Thermal Model for Si4620DY
Si4670DY-RC	RC Thermal Model for Si4670DY
Si4816BDY_RC	R-C Thermal Model Parameters
Si4830CDY-RC	RC Thermal Model for Si4830CDY
Si4830CDY_RC	R-C Thermal Model Parameters
Si4914BDY-RC	RC Thermal Model for Si4914BDY
Si4916DY-RC	RC Thermal Model for Si4916DY
Si5853DDC-RC	RC Thermal Model for Si5853DDC
Si5853DDC_RC	R-C Thermal Model Parameters
Si5855CDC-RC	RC Thermal Model for Si5855CDC
Si5855CDC_RC	R-C Thermal Model Parameters
Si5913DC-RC	RC Thermal Model for Si5913DC
Si5913DC_RC	R-C Thermal Model Parameters
Si7703EDN-RC	RC Thermal Model for Si7703EDN
Si7980DP-RC	RC Thermal Model for Si7980DP
Si7980DP_RC	R-C Thermal Model Parameters
SiA811ADJ-RC	RC Thermal Model for SiA811ADJ
SiA811ADJ_RC	R-C Thermal Model Parameters
SiA814DJ-RC	RC Thermal Model for SiA814DJ
SiA814DJ_RC	R-C Thermal Model Parameters
SiB800EDK-RC	RC Thermal Model for SiB800EDK
SiB800EDK_RC	R-C Thermal Model Parameters
SiR770DP_RC	R-C Thermal Model Parameters
SiZ790DT_RC	R-C Thermal Model Parameters

Reel Info [top]
Reel Information	Lok Reel

Reliability Data [top]
Package Reliability	Environmental and Package Testing Data for ChipFET® (1206-8)
Package Reliability	Environmental and Package Testing Data for PowerPAIR® 6 x 3.7
Package Reliability	Environmental and Package Testing Data for PowerPAK® 1212-8
Package Reliability	Environmental and Package Testing Data for PowerPAK® SC-70
Package Reliability	Environmental and Package Testing Data for PowerPAK® SC-75
Package Reliability	Environmental and Package Testing Data for PowerPAK® SO-8
Package Reliability	Environmental and Package Testing Data for SO-8
Package Reliability	Environmental and Package Testing Data for TSOP-6
Silicon Technology Reliability	N-Channel Accelerated Operating Life Test Result
Silicon Technology Reliability	N-Channel Accelerated Operating Life Test Result
Silicon Technology Reliability	N-Channel Accelerated Operating Life Test Result
Silicon Technology Reliability	P-Channel Accelerated Operating Life Test Result
Silicon Technology Reliability	P-Channel Accelerated Operating Life Test Result
Silicon Technology Reliability	Schottky Diode Accelerated Operating Life Test Result
Silicon Technology Reliability	SkyFET® (N-Channel MOSFET and Schottky Diode) Accelerated Operating Life Test Result

Tape Info [top]
91-5209-x	Tape Drawing for SOIC PACKAGES (NARROW AND WIDE BODY)
93-2345-X	TSOP: 5/6-Lead (SC-59)
Device Orientation	Device Orientation for PowerPAIR
PACK-0007-13	Device Orientation for 1206-8 ChipFET (T1)
PACK-0007-14	Device Orientation for PowerPAK 1212-8 and PowerPAK SO-8 (T1)
PACK-0007-21	Device Orientation PowerPAK® SC-70, PowerPAK SC-75,Thin PowerPAK SC-70, Thin PowerPAK SC-75
PACK-0007-6	Device Orientation for MSOP, SOIC, SSOP, and TSSOP (T1)
PACK-0007-8/9	Device Orientation for SC70-6L, SC89-6L, TSOP-6 (Single, Dual, Complementary or Dual Symmetrical) (T1)
Tape Information	1206-8 ChipFET®
Tape Information	PowerPAIR 6 x 3.7 CARRIER TAPE
Tape Information	PowerPAK SC70
Tape Information	PowerPAK® 1212
Tape Information	PowerPAK® SC-75 AND THIN PowerPAK SC-75
Tape Information	PowerPAK® SOIC-8

Technical Notes [top]
Specification Comparison	Si4830CDY vs. Si4830ADY
Specification Comparison	Si4833BDY vs. Si4833ADY
Specification Comparison	Si4914BDY vs. Si4914DY
Specification Comparison	Si5853DDC vs. Si5853CDC
Specification Comparison	Si5855CDC vs. Si5855DC
Specification Comparison	SiA811ADJ vs. SiA811DJ
Specification Comparison:	Si4816BDY vs. Si4816DY

SPICE [top]
H-Spice Model	P-Spice Model (*.lib)	P-Spice Model (*.olb)	P-Spice Model (*.txt)	Spice Model (pdf)
Si3805DV-H Si4620DY-H Si4816BDY-H Si4823DY-H Si4830CDY-H Si4914BDY-H Si5855CDC-H Si5913DC-H Si7703EDN-H Si7980DP-H SiA811ADJ-H SiA814DJ-H SiZ790DT-H	Si3805DV-P LIB Si4620DY-P LIB Si4816BDY-P LIB Si4823DY-P LIB Si4830CDY-P LIB Si4914BDY-P LIB Si5855CDC-P LIB Si5913DC-P LIB Si7703EDN-P LIB Si7980DP-P LIB SiA811ADJ-P LIB SiA814DJ-P LIB SiZ790DT-P LIB	Si3805DV-P OLB Si4620DY-P OLB Si4816BDY-P OLB Si4823DY-P OLB Si4830CDY-P OLB Si4914BDY-P OLB Si5855CDC-P OLB Si5913DC-P OLB Si7703EDN-P OLB Si7980DP-P OLB SiA811ADJ-P OLB SiA814DJ-P OLB SiZ790DT-P OLB	Si3805DV-P Si4620DY-P Si4816BDY-P Si4823DY-P Si4830CDY-P Si4914BDY-P Si5855CDC-P Si5913DC-P Si7703EDN-P Si7980DP-P SiA811ADJ-P SiA814DJ-P SiZ790DT-P	Si3805DV-DS Si4620DY-DS Si4816BDY-DS Si4823DY-DS Si4830CDY-DS Si4914BDY-DS Si5855CDC-DS Si5913DC-DS Si7703EDN-DS Si7980DP-DS SiA811ADJ-DS SiA814DJ-DS SiZ790DT-DS